New Arrivals

CTI Cryotorr 8 Cryo pump. Needs rebuild. Sold As is

ABM High Performance Tabletop Deep UV Mask Alignment and DUV Exposure System. Table top mask aligner. Adjustable vacuum contact or proximity printing. Precision alignment module for piece parts up to 4” maximum, currently configured with a 100mm diameter chuck. Different sizes available at additional price. Uniform collimated exposure beam, final lens diameter is 6.5”. Wavelength: 220nm. 500W power supply. Dual cameras for alignment. 120V, 50/60 Hz.

Advanced Energy RFX 600 Plasma 13.56Mhz 600W RF Generator. Intended for continuous hard use in a vacuum environment. Multiple regulation modes and superior arc quenching make this an industry leader. Digital display and setpoint. Power: 600W into a 50 ohm load. Frequency: 13.56 MHz. Cooling: Forced air. Max. Ambient Temp.: 45°C, 92% relative humidity. Free airflow must be provided. RF Output Connector: Type N. 208V, 1Ph, 50/60 Hz 3 AVAILABLE

Affinity FAE-121L-EE10CAD4 Air Cooled Recirculating Chiller. Refrigerent: R407. Nominal Heat Removed: 9.8 kW at 20 deg C. Pump Performance: 10 gpm at 55 psi. 1-3/4 inch NPT coolant supply/return lines. 460, 277, 380V, 3 Ph, 50/60 Hz, 37A, CE.

AITEC AR-SV3G-100 Wafer Transfer Robot. Was used in a vacuum cluster tool. No cables or controllers.

Allwin21 Accuthermo AW610 Rapid Thermal Processor.

The AccuThermo AW610 is a rapid thermal processing (RTP) system, which uses high intensity visible radiation to heat single wafers for short process periods of time at precisely controlled temperatures. The process periods are typically 1‑600 seconds in duration, although periods of up to 9999 seconds can be selected. The AccuThermo RTP AW610M rapid thermal annealing system consists of an oven unit and a controller computer running the Allwin21 RTAPRO controller software. The wafer to be processed is placed on a quartz tray that slides into a quartz isolation tube in the oven unit. Four banks of lamps, two above the quartz tube and two below it, provide the source of energy for heating the wafer. The lamps can be controlled manually and automatically from the controller computer. The RTAPRO control software allows full control and diagnostics of the AccuThermo RTP system.  In addition, it allows the creation of recipes for automated control of the temperature and, optionally, process gas flow. The control software uses a set of operating instructions known as recipes to automatically control the AccuThermo RTP system. These recipes are created by the Process Engineer to monitor and control the parameters of the processing cycle. The Operator then uses the software to select and run the process parameters (steady state temperature, process time, ramp rates, etc.).

HEATPULSE 610 Features

Manually loaded and capable of processing silicon and III-V substrates up to 150mm in diameter, Heatpulse 610 provides solutions to your process development and monitoring needs. Equipped with a graphical user interface to improve operator productivity, Heatpulse 610 offers recipe management and system diagnostics.

HEATPULSE 610 Major System Features

• Semiconductor grade quartz process chamber
• 21 tungsten halogen lamps in an upper and lower array
• Extended Range Pyrometer: 400°C -1300oC (200°C w/TC)
• Graphical User Interface(GUI)

These capabilities, combined with the heating chamber’s cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

HEATPULSE 610 Key Features Include

• Closed-loop temperature control with pyrometer or thermocouple temperature sensing.
• Precise time-temperature profiles tailored to suit specific process requirements.
• Fast heating and cooling rates unobtainable in conventional technologies.
• Consistent wafer-to-wafer process cycle repeatability.
• Elimination of external contamination.
• Small footprint and energy efficiency.

HEATPULSE 610 Performance Specifications

• Recommended Steady State Temperature Range: 400-1250° C.
• Steady-State Temperature Stability: ± 2° C.
• Temperature Monitoring Mechanisms: Extended Range Pyrometer (ERP), used throughout the recommended temperature range, or a thermocouple, used for process temperatures below 400° C.
• Heating Rate: 1-200° C per second, user-controllable.
• Cooling Rate: Temperature dependent; max 150° C per second.
• Maximum Non-uniformity:
• ±5°C across a 6″ (150mm) wafer at 1150°C. (This is a one sigma deviation 100 angstrom oxide.) For a titanium silicidation process, no more than 4% increase in non-uniformity during the first anneal at 650°C to 700 °C.
• Post-anneal sheet resistivity measured on a 150mm wafer annealed at 1100° C for 10 seconds. R&D models optimized for slip control.
• Implant: As 1E16 50 KeV with implant uniformity ≤0.3%
• Lamp Life: Unconditionally guaranteed for three years.
• Steady State Time: 1-9999 sec. (1-600 sec. recommended)
• Wafer Sizes for the HEATPULSE 610: 2″, 3″, 4″, 5″ and 6″.
• Process Gases: The HEATPULSE system delivers one non-corrosive process gas with manually controlled flow. Two process gas inputs installed.

AMI MSP-485 Precision Semi-Automatic Screen Printer. The MSP-485 uses the patented AMI Torsion Bar squeegee head with a reciprocating substrate carriage and features front-panel programmable print stroke and process delays. Printer functions are processed by a programmable logic controller (PLC). A number of print modes are possible. Squeegee speed, stroke lift and end points, as well as the print head controls, are set manually. Precision adjustments and locks allow for reproducible and repeatable setups. Print alignment to the screen image is accomplished using a precision incremental stage. The stage can be manually adjusted in the "X" axis, the "Y" axis and in the "T" axis. The "T" axis, or Theta axis, is a true rotation about the center point of the stage. This allows for adjustments in the alignment rotation without compromising adjustments in the X and Y alignment.