Photoresist: Coaters - Tracks

Cee Brewer Science 200CB Photoresist Spin Coater and Hot Plate Combination Tool. Features the accuracy and repeatability needed to eliminate processing variability from photoresist and thin film deposition processes. User friendly interface touch screen with expanded multi-level programming. Can accommodate substrates up to 200mm round or 7 in. square. 115V, 50/60 Hz, 15A.

Cee Brewer Science 100CB Photoresist Spinner and Hotplate. Brewer Science Cee spinner hot plate combo. The popular CB series features the 100 series spinner and 1110 hotplate into one compact and microprocessor controlled benchtop unit. Programmability: Vacuum fluorescent display and alpha-numeric keypad allows easy user input and controls all spin and bake parameters combining the best of the Cee 100 and the Cee 1110. Specifications: Up to 200mm round or 6 in. square substrates. 0-6000 rpm spin range. 1- 30,000 rpm/sec acceleration unloaded. Hot Chuck size: 10 in. x 10 in. Temp. Range: 50-300 deg C. Temp. Control: Programmable Digital PID. Dimensions: 38 in. L x 13 in. W x 13 in. H. Weight - 79 lbs. Precision: Repeatability is +/-5 rpm with a resolution of 1 rpm for the spincoater. The hotplate has a 0.3 percent temperature uniformity across the working surface. 110V, 50/60 Hz.

FAS Technologies MicroE™ 200 Extrusion Coating System. Uses high precision extrusion technology to coat materials in a wide range of viscosities. Coats very thick layers (100 micrometers) in a single step. Repeatable digitally programmed process. Greater material utilization than spin coating (typical 75 percent of dispensed material remains on the wafer). Sold As Is.

FAS Technologies MicroE™ 200 Cassette to Cassette Extrusion Coating System with Stacked Bake/Chill Oven. System is capable of coatings over 100 micron thick in one process step with uniformities surpassing +/- 2 percent. Material utilization is 75 percent compared to 5-10 percent for spin coating. This means lower cost of material and reduced expense of waste disposal. Increased process uniformity. Uses high precision extrusion technology. Ability to coat materials in a wide range of viscosities. Repeatable digitally programmed process. With Genmark Mini Max Gencobot 7S/3L Handler. Model JS-9940 stacked bake unit with 3 ovens.

Headway Research PWM32-PS-R790 Photoresist Spinner with Digital Programmable Controller. Mounted in a Headway cabinet. Up to 10,000 rpm for relatively light loads such as silicon wafers, small photomasks. Maximum substrate size up to 5-inch. Does not have dispense pumps or lines. Will need vacuum source for wafer hold-down. 120V, 60 Hz.

Headway Research PWM32-R790 Photoresist Spinner Mounted in Exhaust Hood Table. Spin coater for substrates up to 5 in. diameter or diagonal. The bowl diameter is 7.9 in. ID. Up to 10,000 rpm for relatively light loads such as silicon wafers or small photomasks. Two HDP98 pump fluid dispensers included at no additional price but these are not tested or part of warranty. PWM32 digital controller. Unit is mounted on a table with a stainless fume hood. 120V, 50/60 Hz, 10A.

Headway Research 1-PM101D-R485 Photoresist Spinner with Motor Control Unit. Extremely versatile and reliable line of equipment for coating silicon and germanium wafers and large glass and ceramic substrates with photo sensitive material. Great flexibility for labor production line. Close loop servo control amplifier and electro-dynamic brake. Digital tachometer and automatic cycle timer. Adjustable acceleration from 50 to 5,000 rpm/sec. 8-inch dia. bowl. Vacuum chuck.

Headway Research PWM32/CB-15 6 ft. Wet Bench with Photoresist Spinner. Headway PWM32 digital spinner controller with a 15” dia. spinner mounted in the wet bench. Wet bench includes a sink with water spigot 12” x 12” x 12”. One Rinse Tank: 9” L x 7½” W x 7” H. Single Bath: 10” L x 8” W x 6” H.

Karl Suss RC8-MS3 Photoresist Spinner. Unique design provides a better uniformity than conventional spin coaters. Reduces resist consumption by up to 50 percent. Fully programmable process parameters. Handles up to 8 in. round substrates. (Depends on chuck installed). 110V, 60 Hz, CE.

Laurell WS-500-8TFM WS-500 Series Spin Processor Developing Station for up to 200mm Wafers. Process spinner. For cleaning, etching, developing processes on wafers up to 200mm. Features a locked, counter balanced, clear dome chamber for a protected view of the process without exposure to vapors or chemicals. Mounted in a Bettcher RA36FRPP wet bench. Up to 20 fifty step programs can be stored in the controller. 120V, 60 Hz.