Photoresist: Coaters - Tracks

Ultrasonic Systems P450-1-151 Selective Coating System. Programmable selective coating system for precise application of a wide range of materials for the semiconductor, electronics, medical and industrial markets. Features Ultra-Spray technology which enables more accurate, thinner coating applications than conventional spray and dispensing technology. Currently configured with CAT ILDS head. Conveyor system. Graphical user interface. 115V, 50/60 Hz, 13A, CE.

SVG Site Services 8632CTD/8636HPO Developer-Exposure Track. Single track developer configured with 2 elevators, one spinner and one bake. System has an OAI 0130-042-20 deep UV. 220 nanometer exposure tower capable of up to 2000W. Currently configured for 4 in. wafers.

FAS Technologies MicroE™ 200 Extrusion Coating System. Uses high precision extrusion technology to coat materials in a wide range of viscosities. Coats very thick layers (100 micrometers) in a single step. Repeatable digitally programmed process. Greater material utilization than spin coating (typical 75 percent of dispensed material remains on the wafer). Sold As Is.

FAS Technologies MicroE™ 200 Cassette to Cassette Extrusion Coating System with Stacked Bake/Chill Oven. System is capable of coatings over 100 micron thick in one process step with uniformities surpassing +/- 2 percent. Material utilization is 75 percent compared to 5-10 percent for spin coating. This means lower cost of material and reduced expense of waste disposal. Increased process uniformity. Uses high precision extrusion technology. Ability to coat materials in a wide range of viscosities. Repeatable digitally programmed process. With Genmark Mini Max Gencobot 7S/3L Handler. Model JS-9940 stacked bake unit with 3 ovens.

Headway Research PWM32/CB-15 6 ft. Wet Bench with Photoresist Spinner. Headway PWM32 digital spinner controller with a 15” dia. spinner mounted in the wet bench. Wet bench includes a sink with water spigot 12” x 12” x 12”. One Rinse Tank: 9” L x 7½” W x 7” H. Single Bath: 10” L x 8” W x 6” H.

Laurell EDC-650-15NPP Etch Develop Clean Process Spinner. This advanced research and development tool is flexible, safe and affordable. The EDC series is typically employed for both solvent and aqueous-based processing: Etch-Rinse-Dry, Develop-Rinse-Dry, as well as solvent and aqueous cleaning. The spin processor features zero-porosity Teflon® fluid path with an onboard dispense valve manifold. A clear ECTFE dome shaped lid allows safe visibility of your process as it runs, even during single step process development mode. FULLY TESTED AND READY TO SHIP.

Laurell WS-500-8TFM WS-500 Series Spin Processor Developing Station for up to 200mm Wafers. For cleaning, etching, developing processes on wafers up to 200mm. Features a locked, counter balanced, clear dome chamber for a protected view of the process without exposure to vapors or chemicals. Up to 20 fifty step programs can be stored in the controller. 120V, 60 Hz. UNIT HAS BEEN TESTED AND IS READY TO GO.