Photoresist: Coaters - Tracks

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR CEE SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Benchtop Spin Coater and Hot Plate. Maximum substrate size: 200mm round or 6 in. x 6 in. sq. Fully programmable with multi-step processing. Controlled spin environment for ultra high uniformity film thickness. Spin speed: 0 to 6000 rpm. Acceleration: 1 to 30,000 rpm/sec. Hot plate temp. range: 50 to 300 deg C. Hot chuck size: 10 in. x 10 in.

Cassette to Cassette Photoresist Developer Track with Hot Plate Bake and Chill. System was used in research environment to process 6 in. sq. substrates. Consists of two elevator units, one teflon bowl with four dispense valves, one hot plate bake unit and one cool plate. The spinner parameters are programmable via multiline control panel. The hot plate temperature range is 50 deg C to +300 deg C and is programmable. Vacuum contact, proximity and gravity contact.

Cassette to Cassette Photoresist Spinner with Hot Plate Bake and Cool. Fully programmable automated coat/bake track system. Currently configured for 6 in. squares. Spinner with backside rinse. Max. Spin Speed: 6000 rpm. Programmable acceleration control from 1 to 30,000 rpm/sec. Storage of 10 recipes with up to 10 steps/recipes. Hot Plate Max. Temp.: 300 deg C. Programmable proximity, gravity contact and vacuum contact. Cooling plate. Sold As Is Untested.

Photoresist Spinner and Hotplate. Brewer Science Cee spinner hot plate combo. The popular CB series features the 100 series spinner and 1110 hotplate into one compact and microprocessor controlled benchtop unit. Programmability: Vacuum fluorescent display and alpha-numeric keypad allows easy user input and controls all spin and bake parameters combining the best of the Cee 100 and the Cee 1110. Specifications: Up to 200mm round or 6 in. square substrates. 0-6000 rpm spin range. 1- 30,000 rpm/sec acceleration unloaded. Hot Chuck size: 10 in. x 10 in. Temp. Range: 50-300 deg C. Temp. Control: Programmable Digital PID. Dimensions: 38 in. L x 13 in. W x 13 in. H. Weight - 79 lbs. Precision: Repeatability is +/-5 rpm with a resolution of 1 rpm for the spincoater. The hotplate has a 0.3 percent temperature uniformity across the working surface. 110V, 50/60 Hz.

Photoresist Spin Coater and Hot Plate Combination Tool. Features the accuracy and repeatability needed to eliminate processing variability from photoresist and thin film deposition processes. User friendly interface touch screen with expanded multi-level programming. Can accommodate substrates up to 200mm round or 7 in. square. 115V, 50/60 Hz, 15A.

Photoresist Spinner and Hotplate. Brewer Science Cee spinner hot plate combo. The popular CB series features the 100 series spinner and 1110 hotplate into one compact and microprocessor controlled benchtop unit. Programmability: Vacuum fluorescent display and alpha-numeric keypad allows easy user input and controls all spin and bake parameters combining the best of the Cee 100 and the Cee 1110. Specifications: Up to 200mm round or 6 in. square substrates. 0-6000 rpm spin range. 1- 30,000 rpm/sec acceleration unloaded. Hot Chuck size: 10 in. x 10 in. Temp. Range: 50-300 deg C. Temp. Control: Programmable Digital PID. Dimensions: 38 in. L x 13 in. W x 13 in. H. Weight - 79 lbs. Precision: Repeatability is +/-5 rpm with a resolution of 1 rpm for the spincoater. The hotplate has a 0.3 percent temperature uniformity across the working surface. 110V, 50/60 Hz.

E-Beam Photoresist Curing Tool. As Is, Not Working. Capable of exposing large area substrates uniformly at a precision dose. Beam voltage is variable from 5 to 30 kV in 115V steps. The system is computer controlled. Will accommodate standard round silicon wafers or slices from 100mm to 150mm dia. or square plates up to 4 in. x 4 in.

Extrusion Coating System. Uses high precision extrusion technology to coat materials in a wide range of viscosities. Coats very thick layers (100 micrometers) in a single step. Repeatable digitally programmed process. Greater material utilization than spin coating (typical 75 percent of dispensed material remains on the wafer).

Cassette to Cassette Extrusion Coating System with Stacked Bake/Chill Oven. System is capable of coatings over 100 micron thick in one process step with uniformities surpassing +/- 2 percent. Material utilization is 75 percent compared to 5-10 percent for spin coating. This means lower cost of material and reduced expense of waste disposal. Increased process uniformity. Uses high precision extrusion technology. Ability to coat materials in a wide range of viscosities. Repeatable digitally programmed process. With Genmark Mini Max Gencobot 7S/3L Handler. Model JS-9940 stacked bake unit with 3 ovens.

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR HEADWAY RESEARCH SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Photoresist Spinner. Capable of spinning up to 9 in. dia. substrates. EC101-D controller. 15 in. dia. bowl. RPM Range: 50 to 10,000. Acceleration: 0.25 sec. to 1.25 sec. 115V, 50/60 Hz, 3A.