Grinders-Lappers-Polishers

Seiko Instruments OFL-11 Triple Platen Fiber Optic Polisher. 3 station optical fiber polisher. 100V, 50/60 Hz.

LAPMASTER Model 12 Precision Polishing Machine. Benchtop polishing system. Polishing Plate: 12” dia. Process timer. Holds up to three samples. Variable speed up to 60 rpm. Slurry dispense. 110V, 60 Hz

Wafer Polishing Jig similar to the Logitech Polishing Jigs. 4" capacity. We do not have the vacuum adapters. Multiple jigs available. Price is for each jig. $1500 Each

LAPMASTER Model 15 Benchtop Precision Open Face Polisher. Variable speed. Process timer. Tachometer readout. 15” dia. polishing wheel. 3 crescent yokes for holding fixtures (fixtures not included). Some paint missing or stained but sold fully tested working well.110V, 60 Hz.

Logitech DH-300 Driven Head Precision Polishing System. Developed to address the issue of polishing times when processing semiconductor materials often describe as “hard” to polish within the industry. These systems have been designed for semi-automated final stage polishing of hard materials such as sapphire, silicon carbide (SiC)or gallium nitride (GaN). Features special polishing carrier head that applies high levels of down-force onto the samples, whilst rotational speed and direction are fully controllable. This results in the highest level of sample throughput of any of the Logitech systems.

• Manual Mode’ allows operators to control individual process parameters and variables such as rotational speed and direction of carrier heads via the Graphical User Interface (GUI).
• ‘Automatic Mode’ allows users to save and re-call multi-stage process recipes – making each process completely repeatable, even across different operators.

Struers Abramin Microprocessor Controlled Tabletop Machine for Automatic Grinding, Lapping and Polishing. Does not have sample holder. Eight programmable steps. Rotation Speed: Turntable 150/300 rpm, specimen holder motor 180 rpm. Variable force applied to specimens from 30 to 450N. 10” dia. wheel. 220V, 3 Ph, 60 Hz, 3.6A

Struers AbraPlan 10 Fast Plane Grinding System. Ideal for laboratories or facilities carrying out quality control testing of very large specimens or a high volume of specimens. Fast efficient plane grinding providing high planeness and reproducibility. Grinding wheel motor is 4 kW and the specimen mover motor is .37 kW. Various grinding modes. Large LCD display. Grinding wheel speed: 1450 rpm, 14” dia. wheel. Specimen Rotation Speed: 150 rpm. 220V, 3 Ph, 60 Hz, 15.7A, CE. Does not come with specimen holder, must order separate.

SWECO DM01L Vibro-Energy Grinding Mill. SWECO Vibro-Energy Grinding Mills are the most versatile line of mills available today for fast, low-cost particle size reduction to sub-micron range. Vibro-Energy grinding action achieves higher output per input horsepower; precise control of size and distribution. Product contamination from media and lining wear is virtually eliminated. Maintenance costs are low because of few moving parts and replaceable linings made of abrasion-resistant metal, ceramic or elastomers.
The SWECO Vibro-Energy Mill's unique vibratory motion, coupled with the use of cylindrical media, allows a dense packing of the media bed assuring maximum media surface contact and minimum void area when operated under a low energy condition. Feed materials as large as 300 microns can be reduced to sub-micron sizes. Bowl OD 23 3/4" and depth is 8". 440V,3Ph, 60Hz, 6A

Semiconductor Equipment Corp 3250 Wafer Backlap Applicator.

• Four, five, six and eight inch wafer capability standard.
• Trims tape to the edge of the wafer including the flats, within .005 “.
• Manual tape feed.
• Manual tape tensioner.
• Compatible with standard or interleaved tape.
• Vacuum stage wafer hold-down.
• Built in cutter tape separation systems.
• Captive roller assembly assures consistent wafer/film frame contact pressure.
• Adjustable spring loaded platen for optimum contact pressure.

Includes the optional Items:

• Heated Blade Assembly. Heats cutting blade to reduce friction when cutting particular types of back lapping tapes. Heats to 75 degrees C.
• Motorized Take-up System to gather the liner from dicing tape onto a disposable core. Many semiconductor dicing tapes have a protective liner, which has to be gathered and disposed of. This option makes that process effortless and convenient.