Grinders-Lappers-Polishers

Advanced Imaging Inc. ROBO 4 15 in. Polishing System. PC controller 3.5 in. floppy. 15 in. dia. polishing plate with 8 in. dia. center hole. Swing out polishing jig. Single ring type holder C shaped. 120V, 60 Hz.

Advanced Imaging Inc. Rough Lap Station Polishing System. Heavy duty polishing system. 18 in. dia. polishing wheel capable of holding 4 specimen rings. Digital RPM readout. Motor timer. 115V, 60 Hz.

Buehler Brass Grinding/Polishing Plate. 8-inch diameter. 2 Available.

Buehler Aluminum Grinding/Polishing Plate. 8-inch diameter.  8 Available.

Buehler 10-4320-010 MetAbrase® Abrasive Cut-Off Wheels. Nine brand new in box. 14 in. wheel. Recommended use thickness: HRC 15-35 0.100 in. (2.5mm). Rubber AI2O3.

Buehler Metlap 40-5204 12-inch Grinding Plate for Lapper Polisher. Made for Ecomet IV. New in Box.

Buehler Metlap 40-5208 12-inch Grinding Plate for Lapper Polisher. Made for Ecomet IV. New in Box.

Buehler Metlap 40-5202 12-inch Grinding Plate for Lapper Polisher. Made for Ecomet IV. New in Box.

Buehler Metlap 40-5210 12-inch Grinding Plate for Lapper Polisher. Made for Ecomet IV. New in Box.

Buehler Ecomet IV Polishing Platen for Variable Speed Polisher/Grinder. 12-inch diameter.  2 Available.