Grinders-Lappers-Polishers

Tokyo Seimitsu S-LM-116G Vertical Slicing Machine with ID Diamond Blade. Electronically controlled slicing machine produces quality wafers by precisely cutting an ingot of brittle materials with an ID diamond blade. Blade size OD: 422 mm, ID: 152 mm. Acceptable Ingot Size: Max. 100 mm x 350 mm L. Includes oil mist separator. 220V, 3 Ph, 60 Hz.

Seiko Instruments OFL-11 Triple Platen Fiber Optic Polisher. 3 station optical fiber polisher. 100V, 50/60 Hz.

Logitech VS2 Vacuum System with Water Trap. Vacuum pump and water separator for Logitech polishers. Two port system. 115V, 50/60 Hz.

Speedfam CHEK-FLAT Optical Flatness Measuring System. Devised for optically measuring flatness on non-reflective surfaces in the problem range of 0.0001 in. to .100 in. Without fixturing or calibration, the unique Chek-Flat pattern shows where and by how much a surface is out-of-flat. No anvils.

Logitech LP30 Precision Polishing Systems. 30 cm dia. polishing plate. Lot of 2.

Advanced Imaging Inc. ROBO 4 15 in. Polishing System. PC controller 3.5 in. floppy. 15 in. dia. polishing plate with 8 in. dia. center hole. Swing out polishing jig. Single ring type holder C shaped. 120V, 60 Hz.

Advanced Imaging Inc. Rough Lap Station Polishing System. Heavy duty polishing system. 18 in. dia. polishing wheel capable of holding 4 specimen rings. Digital RPM readout. Motor timer. 115V, 60 Hz.

Buehler Ecomet 3 Variable Speed Grinder Polisher. Polishing Wheel: 8 in. Variable Speed: 50 to 500 rpm. LED display. Constant wheel speed maintained under all load conditions. 110-115V, 1 Ph, 50/60 Hz, 15A.

Progressive Tool Model 3 Edge Sander.