Dicing Saws-Scribers

ADT Advanced Dicing Technologies 982-6 Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck. Air bearing spindle with 2 in. dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting. Date of Mfg.: 9/2004.

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Benetec Labcut 250F Floor Model High Speed Abrasive Cutting Saw. Manually operated and designed for using up to a 250 mm/10-inch cutting wheel for the general work in materials laboratory. 208V, 3 Ph, 60 Hz, CE.

Buehler Isomet 4000 Precision Linear Sectioning Saw. Designed for cutting various types of materials with minimal sample deformation. Precision sectioning tool capable of cutting virtually any material. Easy to read liquid crystal display. Manual 1 micron sample positioning. Linear feed mechanism. User selectable feed rate allows even the most delicate samples to be cut without deformation. Blade Speed: 200 to 5000 rpm. Wafer blade diameters from 3 in. to 8 in. capable. 85-264V, 50/60 Hz, 1 Ph, CE.

Buehler Isomet 4000 Precision Linear Sectioning Saw. Designed for cutting various types of materials with minimal sample deformation. Precision sectioning tool capable of cutting virtually any material. Easy to read liquid crystal display. Manual 1 micron sample positioning. Linear feed mechanism. User selectable feed rate allows even the most delicate samples to be cut without deformation. Blade Speed: 200 to 5000 rpm. Wafer blade dia. from 3” to 8” capable. 85-264V, 50/60 Hz, 1 Ph, CE.

Disco DAC-2SP/86 Automated Dicing Saw. Max. Substrate Size: 150 mm. Range of Indexing: 0.0001 to 99.9999 mm. Minimum Step Indexing: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm. Older dicing saw but in good condition.

Disco DAD522 Precision Automatic Wafer Dicing Saw. Extra-high precision automatic cutting saw for cutting materials such as silicon wafers, glass and small electronic parts made of ceramic. Work Piece Size: 152mm. Theta Axis Rotation: 380 degrees. Dual objective split image microscope. 1.5 kW Synchro Spindle™. Requires house air and water. 200V, 3 Ph, 50/60 Hz.

Dynatex DXB DXB 120 Series Wafer Bonder. The DXB 120 is used for process development and small scale production. With its larger heated vacuum chamber the DXB 120 supports larger wafers. Heated Vacuum Chamber: 11.25 in. dia. On board timer is used to set the bonding process duration. Temp. Range: 100-320 deg F (40-160 deg C). Cycle Time Range: 1 sec - 10 min. Power: 100/120 VAC, 10A, 50/60 Hz. Vacuum Required: 18-25 inHg. Used for mounting wafer substrate. Improves bond quality and repeatability while improving process time during lapping, polishing and dicing.

K&S 984 Dicing Saw 4 inch Spindle. Rebuilt.

K&S 7100 AD Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.