Dicing Saws-Scribers

K&S 982-6 Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6-inch dia. vacuum chuck. Air bearing spindle with 2-inch dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting.

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Lintec RAD-2500F/8 Fully Automatic Wafer Tape Frame Mounter. Consists of alignment function and tape tension control system which reduces voids at lamination. Currently configured for 200mm wafer size. 8-inch frame table (DTF2-8-1 Disco). Ring frame, heater spec. 6-inch VN wafer and 6-inch wafer cassette compliance. Protrusion sensor. 200-230V, 1 Ph, 50/60 Hz, 8A. Date of Mfg.: 2011.

Leco PR-35 Automatic Dual Mount Dual Mold Pneumatic Sample Mounting Press. Two sample mounting presses in one package. Mold diameter: 2 in. Thermostatically controlled heater with integral water cooler. Direct reading pressure gauge. Additional 1-1/4 in. heater molding head. 230V, 1 Ph, 50/60 Hz, 11A.

Ultron UH 114-8 Wafer Frame Film Applicator.  Features an easily adjustable spring-loaded roller assembly, along with film-tensioner bars along both the x- and y-axes to ensure bubble-free lamination of the film to the wafer and film frame. Temperature controlled chuck. Operates with backed or non-backed film. 8-inch diameter maximum wafer size. Retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. 115V, 1 Ph, 50/60 Hz, 3A.