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Dicing Saws-Scribers

Used ADT Advanced Dicing Technologies 982-6

Inventory Number: 54731
Now (USD): $15,000.00

Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck. Air bearing spindle with 2 in. dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting. Date of Mfg.: 9/2004.

Product Details

Used Aremco Accu-Cut 5200

Inventory Number: 61730
Now (USD): $6,500.00

Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

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Used Benetec Labcut 250F

Inventory Number: 61193
Now (USD): $8,500.00

Floor Model High Speed Abrasive Cutting Saw. Manually operated and designed for using up to a 250 mm/10-inch cutting wheel for the general work in materials laboratory. 208V, 3 Ph, 60 Hz, CE.

Product Details

Used Disco DAC-2SP/86

Inventory Number: 38633
Now (USD): $12,500.00

Automated Dicing Saw. Max. Substrate Size: 150 mm. Range of Indexing: 0.0001 to 99.9999 mm. Minimum Step Indexing: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm. Older dicing saw but in good condition.

Product Details

Used Disco DAD522

Inventory Number: 58774
Now (USD): $17,000.00

Precision Automatic Wafer Dicing Saw. Extra-high precision automatic cutting saw for cutting materials such as silicon wafers, glass and small electronic parts made of ceramic. Work Piece Size: 152mm. Theta Axis Rotation: 380 degrees. Dual objective split image microscope. 1.5 kW Synchro Spindle™. Requires house air and water. 200V, 3 Ph, 50/60 Hz.

Product Details

Used Dynatex DXB

Inventory Number: 62792
Now (USD): $6,500.00

DXB 120 Series Wafer Bonder. The DXB 120 is used for process development and small scale production. With its larger heated vacuum chamber the DXB 120 supports larger wafers. Heated Vacuum Chamber: 11.25 in. dia. On board timer is used to set the bonding process duration. Temp. Range: 100-320 deg F (40-160 deg C). Cycle Time Range: 1 sec - 10 min. Power: 100/120 VAC, 10A, 50/60 Hz. Vacuum Required: 18-25 inHg. Used for mounting wafer substrate. Improves bond quality and repeatability while improving process time during lapping, polishing and dicing.

Product Details

Used K&S 984-6

Inventory Number: 56722
Now (USD): $21,500.00

Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.

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Used K&S Spindle

Inventory Number: 57218
Now (USD): $2,500.00

984 Dicing Saw 4 inch Spindle. Rebuilt.

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Used K&S 7100 AD

Inventory Number: 56732
Now (USD): $25,000.00

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

Product Details

Used K&S 7100 ADHM

Inventory Number: 60629
Now (USD): $29,000.00

Precision Dicing Saw Suitable for Hard Materials. Windows based operating system. 4 in. spindle programmable to 30,000 rpm. Blade Size: 4 in. to 5 in. 6 in. dia. porous vacuum chuck. Indexing Axis Resolution: 0.2 micrometers. 200-240V, 1 Ph, 50/60 Hz, 15A.

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