Dicing Saws-Scribers

K&S 984 Dicing Saw 4 inch Spindle. Rebuilt.

K&S 982-6 Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6-inch dia. vacuum chuck. Air bearing spindle with 2-inch dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting.

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Dynatex DXB DXB 120 Series Wafer Bonder. The DXB 120 is used for process development and small scale production. With its larger heated vacuum chamber the DXB 120 supports larger wafers. Heated Vacuum Chamber: 11.25 in. dia. On board timer is used to set the bonding process duration. Temp. Range: 100-320 deg F (40-160 deg C). Cycle Time Range: 1 sec - 10 min. Power: 100/120 VAC, 10A, 50/60 Hz. Vacuum Required: 18-25 inHg. Used for mounting wafer substrate. Improves bond quality and repeatability while improving process time during lapping, polishing and dicing.

Lintec RAD-2500F/8 Fully Automatic Wafer Tape Frame Mounter. Consists of alignment function and tape tension control system which reduces voids at lamination. Currently configured for 200mm wafer size. 8-inch frame table (DTF2-8-1 Disco). Ring frame, heater spec. 6-inch VN wafer and 6-inch wafer cassette compliance. Protrusion sensor. 200-230V, 1 Ph, 50/60 Hz, 8A. Date of Mfg.: 2011.

Leco PR-35 Automatic Dual Mount Dual Mold Pneumatic Sample Mounting Press. Two sample mounting presses in one package. Mold diameter: 2 in. Thermostatically controlled heater with integral water cooler. Direct reading pressure gauge. Additional 1-1/4 in. heater molding head. 230V, 1 Ph, 50/60 Hz, 11A.

Ultron UH 130 Die Matrix Expander Temperature controlled. Consistent repeatability of expansion. Compact tabletop configuration. Adjustable preheat time. Increases throughput and yield through gentle die separation. The expander presents the die in an evenly spaced matrix to facilitate retrieval for pick and place or die attach. Streets remain parallel resulting in much better die presentation. Heated wafer Ram. 115V,1 Ph, 50/60 Hz, 3A.