Used Ultron UH115

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

K&S 961 Wafer Tape Frame Mounter. The K&S Model 961 Wafer Mounting Station enables the mounting of wafers up to 6 inches in diameter. This mounting station is compatible with standard or interleaved UV-curable tape, and contains a vacuum stage wafer hold-down for holding the wafer in position during mounting. A programmable heating stage heats the tape to attain uniform tensioning, the adjustable spring loaded plate ensures optimal contact pressure and a built-in tape cutter facilitates mounted piece extraction. Includes optional static eliminator and tape backing removal assembly. 110V, 50/60Hz, 5A. HERE IS A LINK TO A VIDEO DEMONSTRATION OF THIS TOOL WORKING 

https://youtu.be/AST4UKs81MY

Scifab Series 1000 Deluxe Hard Tissue Microtome.

Disco DAD-2H/6TM Precision Dicing Saw. Can select round or square cut configurations when dicing wafers up to 6” in automatic or manual modes.
Fully programmable. High frequency air spindle variable speed from 10,000 to 40,000 rpm. 360° motor controlled theta  rotation. High precision camera and monitor for easy alignment. OLDER DICING SAW BUT SOLD TESTED AND WORKING!