Rohde & Schwarz RT-ZHD60 100 MHz High Voltage Differential Probe. 

100 MHz high voltage differential probe, 6000 Vpk, 1000 V CAT III, 1000:1/100:1, 40 MOhm // 2,0 pF (differential), including accessories (soft bag, R and S RT-ZA22 safety test leads, R and S RT-ZA24 accessory set)

SEN LIGHTS CORP. PL17-110E Desktop UV Ozone Cleaning System. Manual Shutter.

• Model number: PL17-110
• Body (internal manual shutter)
• Size (mm): 300 x 290 x 310
• Ultraviolet rays wavelength: 254nm
• Ultraviolet rays illuminance: 15mW/cm2
• Irradiation distance: 20 - 75mm
• Light source side, sample pedestal size: 160 x 160mm

Senko APC 8000 Fiber Optic Polishing System. The APC-8000 features a superior fixture-to-platten locking mechanism and other design enhancements giving the user consistent polishing results at high production volumes. The fixture-to-platten locking mechanism confines motion to vertical plane, eliminating horizontal movement in the fixture that may cause damage to the fiber. 110V, 50/60Hz, 4A

Shenzhen Oubel OB-T02 Semi-Automatic SMD Taping Machine. Hot seal or self-adhesive taping. Mitsubishi PLC+7 inch touch screen controller. High precision vertical sealing, good sealing effect with the precision trimmer, trimming do +_ 0.01mm. Packing speed 3000 to 7000 pieces per hour. Packing width 8 to 72mm tape. 110V, 50/60Hz

Shimadzu EI-1003M Turbo Molecular Pump Controller. USed on TMP-803 and TMP-1003 turbo pumps.

Signatone S-1160A-5 Manual Analytical Wafer Probe Station. Wafer prober designed to support a broad range of precision probing applications. 5” diameter vacuum chuck with 5” x 5” stage travel. Linear platen lift. Platen accepts vacuum or magnetic base probe manipulators. Fine platen adjustment. Mitutoyo Microzoom microscope with two long working distance objectives.

Steag (AG Associates) Heatpulse 610 RTP Rapid Thermal Processing System. Manually loaded and capable of processing silicon and III-V substrates up to 150mm in diameter, Heatpulse 610 provides solutions to your process development and monitoring needs. Benchtop system for rapid thermal processing of semiconductor wafers up to 6” dia. max. (Depends on wafer tray with system).

Performance Specifications

• Recommended Steady State Temperature Range: 400-1250° C.
• Steady-State Temperature Stability: ± 2° C.
• Temperature Monitoring Mechanisms: Extended Range Pyrometer (ERP), used throughout the recommended temperature range, or a thermocouple, used for process temperatures below 400° C.
• Heating Rate: 1-200° C per second, user-controllable.
• Cooling Rate: Temperature dependent; max 150° C per second.
• Maximum Non-uniformity:
• ±5°C across a 6″ (150mm) wafer at 1150°C. (This is a one sigma deviation 100 angstrom oxide.) For a titanium silicidation process, no more than 4% increase in non-uniformity during the first anneal at 650°C to 700 °C.
• Post-anneal sheet resistivity measured on a 150mm wafer annealed at 1100° C for 10 seconds. R&D models optimized for slip control.
• Implant: As 1E16 50 KeV with implant uniformity ≤0.3%

Semitool STI 870 Spin Rinser Dryer Double Stack. 6” Wafer Rotor in the top spinner and a 4" Rotor in the bottom spinner. High performance cleaning, rinsing and drying system for 25 wafer batch cassette. This system is capable of cleaning substrates from 2” to 6” round if the correct Rotor is installed for that wafer size. On axis orientation keeps wafers parallel allowing DI water manifolds to spray both sides of product continuously and simultaneously. Built in resistivity monitor. 120V, 50/60 Hz,

Semitool STI ST 260 Spin Rinser Dryer. High performance cleaning, rinsing and drying system for 25 wafer batch cassette. Currently configured with Rotor for 2” wafers. This system is capable of cleaning substrates from 2” to 5” round if the correct Rotor is installed for that wafer size. On axis orientation keeps wafers parallel allowing DI water manifolds to spray both sides of product continuously and simultaneously. Built in resistivity monitor. 120V, 50/60 Hz,

Sunic Systems OLED Vacuum Deposition Chamber. Chamber came from a cluster tool that was producing OLED devices. This chamber was designated Metal Chamber. There are 4 deposition sources in the chamber. The chamber also includes an Ulvac Cryopump and compressor. The inside dimensions are 22"W x 25"D x 32"H. Chamber is being sold as is where is, we cannot test this item.