Bid Service, LLC 225 Willow Brook Rd. Freehold, NJ 07728
Phone: 732-863-9500Email: [email protected]
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EDC 100 Exclusive Design Co. Rigid Disk Cleaning System. Uses brushes and surfactant to scrub disks. LCD display. Analog control of scrub/rinse speed and spin dry speed. 115V, 60 Hz.
Machine Control Specialists 100TX Tabletop Coil Winder.
Specifications
Machine
Model:
Max Wire Size:
18 Ga
Max Coil Diameter:
1:2, 1:1, 2:1, 3:1, 4:1
Control Model MCS2
Control Type:
Embedded - Freescale 32 bit Processors
Display:
4 line x 40 Character Backlit LCD
Input Keypad:
24 Key (1/2" Rubber Tactile Touch)
Program Storage:
3500 lines / Complex and 10 Presets / Simple
I/O Points:
8 in / 8 out (24 VDC)
Programming Software:
MCSCOM for Windows XP/7/8 GUI
Interface:
RS232 for PC Interface
Cascade Microtech Summit 11000 High Precision 200mm Manual Wafer Probe Station. Shielded Microchamber for noise protection. Roll out wafer stage for safe easy wafer loading. 200mm wafer chuck with selectable vacuum ports for easy transition to different wafer sizes. Z-lift range: 5.5mm linear lift with repeatability: 0<2 micron. X-Y stage travel: 203mm x 203mm with a resolution of 0.2” per turn. Mitutoyo microscope with one long working distance objective. Microscope bridge with X-Y translation. Platen accepts vacuum or magnetic base probe manipulators.
The Cee 1100FX Hot Plate is a programmable hotplate for baking resists coated on samples. There are 10 user programs available which contain preset values for bake Ramp/Soak temperatures, bake time and bake method. The bake method options are proximity, soft contact and hard contact. Hard contact promotes best uniformity and minimizes bowing and warping of substrate. Proximity bake provides slower heating of substrate which helps reduce blistering and cracking of films with fast drying solvents. A recommended method is to use proximity bake as prebake and followed up by hard contact bake. Each program allows up to three consecutive bake methods for maximum control of substrate warm up, solvent drying and resin curing characteristics. Specifications: Bake temperature: 300 degrees C maximum Bake temparature resolution: 1 degree C. Substrate size: 150 to 300mm
240V, 1Ph,60Hz
HP 70100A Power Meter Module. 100 kHz to 50 GHz.
MDA Scientific 7100 Continuous Toxic Gas Monitor. User programmable dual level alarms. Output: 4 -20 mA. Built in thermal printer. 115V, 60 Hz.
MKS Granville Phillips 835100-YG-1D Vacuum Quality Monitor Gauge. Gauge used for RGA System. The Granville-Phillips® 835100-YG-1D Gauge for the VQM Vacuum Quality Monitor System measures 1 to 145 amu, with a demountable envelope. NEW, NEVER USED. 2 AVAILABLE
Oriel 87437-1000 UV Flood Exposure System. 500W UV lamp housing operating in the 350 to 450nm spectral region. Beam Size: 8” x 8”. 200-500W Hg arc lamp power supply. System needs new power supply and electronics inside tower. Needs controller upgrade.
AITEC AR-SV3G-100 Wafer Transfer Robot. Was used in a vacuum cluster tool. No cables or controllers.
Balzers BVB 100 PX Throttle Valve. Air operated. 100 mm conflat. 100 mm KF.