West Bond

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope.

West Bond 7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wire Bonder Bonds gold wires ranging from 0.0007” to 0.002”. Three-axis manual micromanipulator, entire mechanism arrayed above the work plane, so there is no limit to size of work piece. All machine configuration constants and bond settings are programmable, prompted by a series of screens. Heated work holder with digital control. 115V, 50/60 Hz, 10A

WEST BOND 747677E-79C Combination Bonder capable of Ball Bonding and Wedge Bonding. Bonder comes with two bond heads, one wedge and one ball bond. Easy and quick change over. Three-axis micromanipulator with entire mechanism above the work plane, no limit to the size of a work piece. Heated stage with digital  controller. Machine configuration constants and bond settings are programmable. 110V, 50/60Hz, 2A

WEST BOND 7372E Convertible Epoxy/Eutectic Die Bonder. Unlimited deep reach access to remote bond targets on large packages with throatless chassis and micromanipulator design. Includes interchangeable tool head assemblies for bonding by either epoxy or eutectic methods. 115V, 50/60 Hz

West Bond 4KE Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball-Wedge Convertible Wire Bonder. Series 4KE models are three-way convertible Semi-Automatic wire bonders of a gantry design. The entire mechanism is arrayed above the work plane, so that it is wide open to accommodate different size and style of work packages. Two-axes X and Y are driven manually by unique West·Bond micro-manipulator for positioning. Microprocessor controlled W (in Y direction) and Z axes are driven by program controlled motors to arch the connection. It is capable of creating a series of parallel, single or multiple arched wires while maintaining identical loop and bond shapes. Cross roller bearings rigidly guided axes are moving orthogonally, with independent pneumatic brakes in X and Y applied on signal. Target the critical bond location manually with the manipulator via moving the crosshairs generated on the screen and image captured from vertical view CCTV camera, then the target will be secured by the brakes to proceed with programmed bonding. A dual force mechanism, operated pneumatically, acts to change between two pre-set force values, and either high or low force may be programmed for any bond. Radiant tool heat with panel mounted, controlled by constant current. With simple exchange of clamp assemblies, bond tool, and wire path provided with the software mode will allow quick conversion between conventional 45º wire feed, deep access wire or ribbon, ball bonding, insulated wire and single point tab / lead bonding. All programmed bond variables as well as machine settings for each bond mode are retained in the machines memory. Bond Force: 10 – 150 grams; (High / Low programmable). Au / Al: 0.7 to 3 mil, Ribbon: 0.5x2 to 1x10 mil, Au Ball Bonding: 0.7 to 2 mil. 115V, 50/60Hz, 3.2A

WEST BOND 7372E Convertible Epoxy/Eutectic Die Bonder. Unlimited deep reach access to remote bond targets on large packages with throatless chassis and micromanipulator design. Includes interchangeable tool head assemblies for bonding by either epoxy or eutectic methods. 115V, 50/60 Hz

West Bond 7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wire Bonder Bonds gold wires ranging from 0.0007” to 0.002”. Three-axis manual micromanipulator, entire mechanism arrayed above the work plane, so there is no limit to size of work piece. All machine configuration constants and bond settings are programmable, prompted by a series of screens. Heated work holder with digital control. 115V, 50/60 Hz, 10A