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West Bond

Used West Bond 7372B

Inventory Number: 63079
Now (USD): $11,500.00

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. Currently configured for epoxy die bonding. With pickup tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope. Does not include work holders. FULLY TESTED AND READY TO SHIP.

Product Details

Used West Bond 7372B

Inventory Number: 63226
Now (USD): $11,500.00

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope.

Product Details

Used West Bond 7372B

Inventory Number: 63227
Now (USD): $10,000.00

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope. FULLY TESTED AND READY TO SHIP.

Product Details

Used West Bond 7700E

Inventory Number: 64006
Now (USD): $16,500.00

West Bond 7700E-79C Thermosonic Ball-Wedge Wire Bonder. Bonds are made by the ball to wedge technique using ultrasonic energy and a heated work holder. Can be configured for gold wire ranging from .0007” to 0.002”. Three axis micromanipulator.  Entire mechanism is arrayed
above work plane so a larger size work piece can be accommodated. Includes optional heated work holder, microscope and radiant heat options.   115V , 50/60Hz  "VERY NICE CONDITION" Hardly Used.

Product Details

Used West Bond 7476E

Inventory Number: 64011
Now (USD): $16,500.00

West Bond 7476E Wire Wedge Bonder. The West Bond Model 7476E Wedge Wire Bonder is an advanced bench-top microprocessor controlled ultrasonic /thermosonic wedge–wedge wire bonder designed to manually interconnect wire leads to semiconductor, hybrid or microwave devices. The machine bonds aluminum or gold wire ranging from 0.7 mil to 2 mil (1mil =0.001”~ 25µm) diameter. Bonds are made by wedge-wedge technique using ultrasonic energy to attach Al wire at room temperature or adding work piece heat for Au wire bonding. Wire is threaded and clamped diagonally using a 45 ° wire feed assembly to guide the wire under the bonding wedge allowing independent feeding action but requiring front-to-back bonding direction. The three-axis micromanipulator is arrayed above the work plane with range of motion of 0.562” vertically and 0.625” in the horizontal direction. UNLIMITED DEEP REACH access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. The forward pivot tool assembly is built around K-Sine transducer operated at 63KHz and 8Vrms maximum. Thirty separate buffers of bond setting and machine configurations are programmable at the machine front panel and are displayed by a 40 character LCD screen. 115/230V, 50/60Hz

VERY NICE CONDITION!

Product Details