Sikama

SIKAMA FALCON 5/C Benchtop Solder Reflow Oven. Combines bottom-up conduction and top-down convection with precise calibration of temperature and purity of atmosphere for ultimate reflow process. The 4 heating zones can be individually monitored to a very exact temperature profile for the reflow process. Maximum Temperature: 400°C. Maximum Substrate Size: 5” x 5.75”. Pusherbar transport mechanism to move products in a linear motion over the heated stages.
208V, 1 Ph, 50/60 Hz, CE.