PVA TEPLA

PVA TEPLA ION 100/40Q WB Plasma Barrel Asher. Quartz Barrel photoresist asher and plasma surface treatment system. The Photoresist Ashing IoN 100-40Q Plasma System is a barrel plasma reactor designed for high volume production applications.

Features include:

• Plug and play self installation
• Industrial computer with LCD touch panel and keyboard. Windows based operating system.
• Graphical User Interface (GUI) software complies with CFR Title 21 Part 11 and Semi E95-1101
• Multi-level of user access
• Software
  • Recipe editor for fast and versatile step controls
  • Onboard diagnostic features and alarm logging
  • Remote process monitoring via Ethernet

  • Process Chamber

    Material: Quartz chamber
    Dimensions: 304 mm D x 508 mm L (12”X20”)
    Volume: 37 L (1.31 ft3)
    Chamber Opening: 289.56 mm (11.4”)
    Electrodes: Clam-shell
    Number of MFCs: 3
    Process Pressure: (0.16 to 2.66) mbar (120 to 2000) mTorr
    Base Pressure: 0.07 mbar (50 mTorr)
    Pumping Time: 1 min (Pump dependent)
    Wafer Sizes: Up to 200 mm (8”) Batch size (Boat):
    25 wafers of diameter 200 mm (8”)
    50 wafers of diameter 150 mm (6”)
    Wafer Loading: Manual
    Plasma Source Frequency/power: 13.56 MHz/600 W

  • 230V, 1Ph, 50/60Hz, 10A, CE
  • DOES NOT INCLUDE VACUUM PUMP AT THIS PRICE