K&S

K&S 961 Wafer Tape Frame Mounter. The K&S Model 961 Wafer Mounting Station enables the mounting of wafers up to 8 inches in diameter. This mounting station is compatible with standard or interleaved UV-curable tape, and contains a vacuum stage wafer hold-down for holding the wafer in position during mounting. A programmable heating stage heats the tape to attain uniform tensioning, the adjustable spring loaded plate ensures optimal contact pressure and a built-in tape cutter facilitates mounted piece extraction. Includes optional static eliminator and tape backing removal assembly. 110V, 50/60Hz, 5A

K&S 4523AD Programmable Digital Wedge Bonder with Auto Step Back Function. Manages 200 programs with up to 6 channels per program. Motorized Y axis and programmable auto step back for precise wire length and loop formation. Auto second bond made for complete single wire programmed sequence. Headed work holder included. 115V, 50/60 Hz, 4A, CE.

K&S 4526 Auto Stepback Wedge Bonder. Designed for aluminum wire, gold wire and ribbon.  Appropriate for quality applications that require tight control of wire length and loop formation. Ideal for deep cavity microwave applications. One bonding head for deep access and standard bonding. Wire: Gold 12.7 to 76µm, Aluminum 20 to 76µm.  Modes of Operation: Semiauto, Manual Z, Stitch and Lange Coupler. Includes heated work holder.