K&S

K&S 4524AD Programmable Digital Ball Bonder. SOLD AS IS- Keypad buttons bad. Manages 200 programs with up to six channels per program. Motorized Y axis and programmable auto-stepback function for precise wire length and loop formation. Digital readout of all bonding parameters. Auto-second bond mode. No Heated work holder. StereoZoom microscope. 115V, 50/60 Hz, 4A, CE.

K&S 4124 Gold Ball Wire Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz. See video of system after refurbishment: 

https://youtu.be/M3tgqdcOo0w

K&S 4523 Manual Deep Access Wedge Wire Bonder. Offers the versatility to bond simple discrete devices up to complex hybrid, microwave devices. Individual bond parameter and loop height control. Consistent tail length. Can be configured for wire sizes from 0.7 to 3.0 mil. Includes optional heated work holder and spotlight targeting. Includes StereoZoom microscope. 115/220V, 50/60 Hz, 4A, CE.

K&S 4523 Manual Wedge Wire Bonder. Offers the versatility to bond simple discrete devices up to complex hybrid, microwave devices. Individual bond parameter and loop height control. Consistent tail length. Can be configured for wire sizes from 0.7 to 3.0 mil. Includes optional heated work holder and spotlight targeting. Includes StereoZoom microscope. 115V, 50/60 Hz, 4A, CE

K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discrete devices up to complex hybrid, microwave devices. Built-in programmable negative electronic flame-off system provides ball size fine control and consistency. Does not have Heated work holder. Must purchase separately. Digital logic controls all machine functions, including ball size and tail length. StereoZoom microscope. 115V, 50/60 Hz, 4A, CE. Includes fiber optic spotlight target and lighting option.

K&S 961 Wafer Tape Frame Mounter. The K&S Model 961 Wafer Mounting Station enables the mounting of wafers up to 8 inches in diameter. This mounting station is compatible with standard or interleaved UV-curable tape, and contains a vacuum stage wafer hold-down for holding the wafer in position during mounting. A programmable heating stage heats the tape to attain uniform tensioning, the adjustable spring loaded plate ensures optimal contact pressure and a built-in tape cutter facilitates mounted piece extraction. Includes optional static eliminator and tape backing removal assembly. 110V, 50/60Hz, 5A

K&S 4500 Series Wire Bonder Large Surface Heated Work Holder. Vacuum substrate hold down. Top surface dimensions 4 5/8" x 4 5/8"

K&S 4523AD Programmable Digital Deep Access Wedge Bonder with Auto Step Back Function. Manages 200 programs with up to 6 channels per program. Motorized Y axis and programmable auto step back for precise wire length and loop formation. Auto second bond made for complete single wire programmed sequence. Headed work holder. 115V, 50/60 Hz, 4A,

K&S 4524AD Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Motorized Y axis and programmable auto-stepback function for precise wire length and loop formation. Digital readout of all bonding parameters. Auto-second bond mode. Heated work holder and controller included. StereoZoom microscope. 115V, 50/60 Hz, 4A