K&S

High Pressure Microwash Substrate Cleaning System. For sawed/scribed wafers or photomask cleaning. Utilizes an oscillating high pressure deionized water jet spray of up to 2000 psi with 0.2 micron filtration. Handles wafers up to 8 in. dia. depending on type of chuck installed. Touch screen operation. CO2 reionizer for elimination of static charge. Nitrogen dry. Infrared heat lamp. 115V, 50/60 Hz, 6A.

High Pressure Microwash Substrate Cleaning System. For sawed/scribed wafers or photomask cleaning. Utilizes an oscillating high pressure deionized water jet spray of up to 2000 psi with 0.2 micron filtration. Handles wafers up to 8 in. dia. depending on type of chuck installed. Touch screen operation. CO2 reionizer for elimination of static charge. Nitrogen dry. Infrared heat lamp. 115V, 50/60 Hz, 6A.

Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.

984 Dicing Saw 4 inch Spindle. Rebuilt.

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

Manual Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.

Precision Dicing Saw Suitable for Hard Materials. Windows based operating system. 4 in. spindle programmable to 30,000 rpm. Blade Size: 4 in. to 5 in. 6 in. dia. porous vacuum chuck. Indexing Axis Resolution: 0.2 micrometers. 200-240V, 1 Ph, 50/60 Hz, 15A.

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

Manual Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. With spotlight target option. Wire Diameter Range Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60 Hz.

Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6-inch dia. vacuum chuck. Air bearing spindle with 2-inch dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting.