K&S

K&S 984 Dicing Saw 4 inch Spindle. Rebuilt.

K&S 4124 Manual Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.

K&S 7100 AD Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

K&S 4123 Wire Wedge Bonder. Missing microscope parts.

K&S 982-6 Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6-inch dia. vacuum chuck. Air bearing spindle with 2-inch dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting.

K&S 982-6 Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6-inch dia. vacuum chuck. Air bearing spindle with 2-inch dia. blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting.

K&S 4526 Auto-Stepback Wedge Bonder. Designed for aluminum wire, gold wire and ribbon. Appropriate for high quality applications that require tight control of wire length and loop formation. Offers control of individual bond parameters and programmable loop formation. Ideal for deep cavity microwave applications. Features: One bonding head for deep access and standard bonding. Programmable loop formation. Consistent tail length with real time fine adjust. Large bonding. Easy operation. Wire: Gold: 12.7 to 76 micrometers. Aluminum: 20 to 76 micrometers. Motorized Y: Stepback up to 4mm, reverse up to 0.25mm. Kink height up to 0.5mm. Modes of Operation: Semi-auto, Manual Z, Stitch, Lange Coupler. Includes spotlight target option. Does not come with a work holder. 115V, 50/60 Hz, 4A, CE.

K&S 4523D Tabletop Manual Wedge Bonder. Digital controls. Large 5.3 in. x 5.3 in. bonding area. Consistent tail length with fine adjustment. PLL ultrasonic generator and high-Q transducer. StereoZoom microscope. 200 program storage capacity with six independent channels per program. Digital readout of all bonding parameters. 115V, 50/60 Hz, 4A, CE. Does not come with heated work holder, no work holder with this unit.

K&S 4523 Manual Wedge Wire Bonder. Offers the versatility to bond simple discrete devices up to complex hybrid, microwave devices. Individual bond parameter and loop height control. Consistent tail length. Can be configured for wire sizes from 0.7 to 3.0 mil. Includes optional heated work holder and spotlight targeting. Includes StereoZoom microscope. 115/220V, 50/60 Hz, 4A, CE.

K&S 4123 Manual Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple IC’s and discrete devices or complex hybrids with height variations up to 200 mils. Comes with spotlight target. Wire Diameter Range: Gold 05 to 30 mil, Aluminum 1.0 to 3.0 mil. No work holder. 115V, 60 Hz.