Denton Vacuum

DC Sputtering System. Chamber: 12 in. dia. x 18 in. H glass Pyrex bell jar with guard. 15-inch dia. baseplate/pumping plenum assembly supported by system cabinet. System mounted on casters. Pumping System: Turbomolecular pump, LN2 trap located beneath high vacuum poppet valve and manual fill via external funnel. Alcatel 2010 two stage, rotary vane pump. Sputter Source: (1) DSM-300A cold sputter module. 300W DC power supply, 4-inch dia. magnetron sputter source with Denton Vacuum patented ANODE GRID® for maximum electron capture and minimal specimen heating. Variable source to substrate distance. Substrate Fixturing: 8.0 in. Omni rotating fixture plate, speed adjusts via input to system touch screen. Air operated shutter. Control System: The Explorer 14 system is semiautomatic and is controlled by a DL205 CPU from Automationdirect. The operator interface is a touch panel with graphical interface to the PLC. Graphical interface is supported with Automationdirect software. Manual operation of valves, pumps, low voltage sources and fixture rotation subsystems is through this graphical interface. Semiautomatic processes are also operated through this interface.

Laboratory Style Thermal Evaporation Deposition System. Single filament evaporation sources, second thermal source can be added at additional cost. Rotating 6 in. x 6 in. substrate stage. Turbo pumped high vacuum system. Roughing pump built into base. 12 in. dia. x 12 in. H quartz bell jar with implosion guard.

FULLY TESTED AND READY TO SHIP!

Auto Turbo High Vacuum DC Sputtering System. Laboratory or light production thin film DC sputtering system with graphic user interface and touch screen control. Manual or automatic operation of valves, pumps, low voltage sources, and fixture rotation subsystems is through this graphical interface. Deposition Chamber: 14 in. H x 14 in. W x 14 in. D stainless construction. Turbo pump with roughing pump.

(1) Micrometer gas-bleed valve to introduce process gas into the deposition chamber.
(1) Gas isolation (toggle) valve for process gas control.

Sputter Source:
(2) 3.0 in. dia., Denton Vacuum, internal stalk-mount, planar magnetron sputter sources:
I. RF/DC capability, only DC installed.
II. Variable source to substrate distance.
III. Clamp/bond target compatibility.
(2) Independent, electro-pneumatic source shutters (cylinder mounted air flowrate control) interfaced to system PLC for remote open/close operation.

Sputter Power Supply:
Sorensen DCS Series power supply (1.0 kW, 600 VDC). DC switch to shunt the output of the Sorensen DCS power supply to any of the (2) installed cathodes. Substrate Stage: 6.0 inch omni rotating fixture plate (sputter-down configuration). Speed adjust via input to system touch screen.

Sputter Coater for SEM Samples. Provides a uniform, conductive, fine grained coating. Self-contained unit with built-in pump. Advanced design magnetron sputterhead for truly cold sputtering. Etch mode for sample cleaning. 6 in. OD pyrex chamber. Sputters precious metals, no target included. Does not require gas. 120V, 50/60 Hz, 10A.