Used Q Corporation QMT-1000

Pulse Heating Power Supply with NT-5A Transformer.

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

Epoxy Die Bonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.

Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.

Chip Placement System for use with Pre-Screened Adhesives. Simple vacuum pick up tool for die pick and place. StereoZoom microscope.

Assembly Work Cell. Ultra-precise, high speed, vision guided, flexible, inline. Large work surface accommodates most input and output options. Pick and place. Inspection station with bottom mounted camera, looks like flip chip? Call for additional photos.

Automated Gold Ball Bonder. Flying bondhead operates by means of a frictionless air bearing. System has programmable focus option. E-Stop and Venturi vacuum. 2 in. x 2-1/2 in. work table travel. Programmable X-Y-Z indexer. Currently 80 micron machine. Sold As Is, spare parts machine.

Chip Placement System for use with Pre-Screened Adhesives. Ideal for LED’s and multiple chip placement on hybrids where epoxies or gold pastes are prescreened on the substrate.

Optoelectronics Laser Welding System. Parts tool only, no electronics with system, just what is in the photos. Alignment fixturing inside laser box on a vibration isolation table.

High Vacuum Thermal DAP Package Sealer. The HI VAC-2200 GT system is used for soldering, brazing or glass sealing of components requiring low residual gas environment or low moisture content. The system also has the capability of providing for a high vacuum, in-process bake for the removal of contaminating volatiles prior to backfilling with the controlled atmospheres of your choice. 220V, 1 Ph, 50/60 Hz, 100A.

Typical Applications: Package sealing requiring controlled internal environment. Void free, flux free soldering for die attach, MCM assembly, power components and flip chip attach. Glass fusion and glass to metal sealing. Field emission flat panel display assembly. Glass to silicon, silicon to silicon wafer bonding.

System Features: User friendly menu driven programming. Precise control of temperature (up to 1000 deg C), heating rates, dwell times and cooling rates.