Used Leco PR-35

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Lintec RAD-2500F/8 Fully Automatic Wafer Tape Frame Mounter. Consists of alignment function and tape tension control system which reduces voids at lamination. Currently configured for 200mm wafer size. 8-inch frame table (DTF2-8-1 Disco). Ring frame, heater spec. 6-inch VN wafer and 6-inch wafer cassette compliance. Protrusion sensor. 200-230V, 1 Ph, 50/60 Hz, 8A. Date of Mfg.: 2011.

Ultron UH115 Semiautomatic Wafer Frame Film Mounter. The Model UH115 features a semiautomatic one-pass lamination which provides an extra margin of safety when mounting particularly fragile wafers/substrates. Bubble free film lamination. Static Ionization Bar with power safety interlock. Take-up roller assembly. Edge-Contact Workstage for 6" wafers. 240V, 1PH, 50/60Hz, 3A .

Ultron UH115 Semiautomatic Wafer Frame Film Mounter. The Model UH115 features a semiautomatic one-pass lamination which provides an extra margin of safety when mounting particularly fragile wafers/substrates. Bubble free film lamination. Static Ionization Bar with power safety interlock. Does not come with Take-up roller assembly option. Edge-Contact Workstage for 6" wafers. 115V, 1PH, 50/60Hz, 3A