Used Leco PR-35

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Lintec RAD-2500F/8 Fully Automatic Wafer Tape Frame Mounter. Consists of alignment function and tape tension control system which reduces voids at lamination. Currently configured for 200mm wafer size. 8-inch frame table (DTF2-8-1 Disco). Ring frame, heater spec. 6-inch VN wafer and 6-inch wafer cassette compliance. Protrusion sensor. 200-230V, 1 Ph, 50/60 Hz, 8A. Date of Mfg.: 2011.

Buehler Abrasimet 2 Abrasive Cut Off Saw.  Abrasive cutter that features a manual cutting action with great cutting capacity, lighting and visibility. With its large work space and versatile vice options, this machine ensures quick and easy positioning of samples for cutting and sectioning. 220V, 3Ph, 60Hz, 9.5A

• Fully enclosed cutting chamber
• Easy to operate
• Emergency Stop button
• Manual chopping action

• Disc Size: 250mm  

  Arbor Size: 32mm

  Wheel RPM: 2830 RPM  

  Vice cutting capacity: 80mm  - 75mm diameter  

  Safety features: Emergency stop, safety switch, electronic break

Leco Spectrum System 1000 Dual Wheel Polisher Grinder. Spectrum System 1000 is an 8 in (200 mm), dual-design grinder/polisher ideal for the low- to medium-volume laboratory. The powerful 0.5 HP (373W) motor drives both 8 inch wheels simultaneously. A built-in timer monitors grinding and polishing times. 110V, 50/60Hz, 10A