Used Leco PR-35

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Lintec RAD-2500F/8 Fully Automatic Wafer Tape Frame Mounter. Consists of alignment function and tape tension control system which reduces voids at lamination. Currently configured for 200mm wafer size. 8-inch frame table (DTF2-8-1 Disco). Ring frame, heater spec. 6-inch VN wafer and 6-inch wafer cassette compliance. Protrusion sensor. 200-230V, 1 Ph, 50/60 Hz, 8A. Date of Mfg.: 2011.

SAMPLMET® 2 Abrasive Cutter, complete bench top unit with recirculating coolant system, includes totally enclosed cutter with 1 HP (735W) motor, 3400 RPM no load speed, 1¼′′ (32mm) diameter solid bar cutting capacity, 1½′′ (38mm) vise capacity, light alloy base casting, molded glass-reinforced-plastic-hood, left-hand cam activated vise, operator controls. 110V, 60Hz, 15A

Leco Spectrum System 1000 Dual Wheel Polisher Grinder. Spectrum System 1000 is an 8 in (200 mm), dual-design grinder/polisher ideal for the low- to medium-volume laboratory. The powerful 0.5 HP (373W) motor drives both 8 inch wheels simultaneously. A built-in timer monitors grinding and polishing times. 110V, 50/60Hz, 10A