Used Buehler Oscillamet

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Lintec RAD-2500F/8 Fully Automatic Wafer Tape Frame Mounter. Consists of alignment function and tape tension control system which reduces voids at lamination. Currently configured for 200mm wafer size. 8-inch frame table (DTF2-8-1 Disco). Ring frame, heater spec. 6-inch VN wafer and 6-inch wafer cassette compliance. Protrusion sensor. 200-230V, 1 Ph, 50/60 Hz, 8A. Date of Mfg.: 2011.

Ultron UH115 Semiautomatic Wafer Frame Film Mounter. The Model UH115 features a semiautomatic one-pass lamination which provides an extra margin of safety when mounting particularly fragile wafers/substrates. Bubble free film lamination. Static Ionization Bar with power safety interlock. Does not come with Take-up roller assembly option. Edge-Contact Workstage for 6" wafers. 115V, 1PH, 50/60Hz, 3A

K&S 961 Wafer Tape Frame Mounter. The K&S Model 961 Wafer Mounting Station enables the mounting of wafers up to 8 inches in diameter. This mounting station is compatible with standard or interleaved UV-curable tape, and contains a vacuum stage wafer hold-down for holding the wafer in position during mounting. A programmable heating stage heats the tape to attain uniform tensioning, the adjustable spring loaded plate ensures optimal contact pressure and a built-in tape cutter facilitates mounted piece extraction. Includes optional static eliminator and tape backing removal assembly. 110V, 50/60Hz, 5A

ALLIED HIGH TECH TECH CUT. Variable Speed Sectioning Saw for Precision Sample Preparation.Variable Blade Speed: 100 to 4000 rpm. Dual Cutting Modes: Constant sample advancement or preset sample load. Automatic sample advancement adjustable rate from 0.15” per min. to 1.50” per min. Auto table retraction after sectioning. 115V, 60 Hz, 3.5A

Scifab Series 1000 Deluxe Hard Tissue Microtome.

Disco DAD-2H/6TM Precision Dicing Saw. Can select round or square cut configurations when dicing wafers up to 6” in automatic or manual modes.
Fully programmable. High frequency air spindle variable speed from 10,000 to 40,000 rpm. 360° motor controlled theta  rotation. High precision camera and monitor for easy alignment. OLDER DICING SAW BUT SOLD TESTED AND WORKING!

ULTRON UH114-8 Wafer/Frame Film Applicator. Uniform bubble-free adhesion. Temperature controlled wafer stage. Operates with backed or non-backed films. Wafer chuck for up to 8” dia. wafers. 115V, 50/60 Hz, 3A