Equipment Photos

Equipment Details

Inventory Number: 64425
Category: Dicing Saws-Scribers
Manufacturer: Buehler

Buehler Oscillamet Metallurgical Wet Type Abrasive Sample Cut-Off Saw. Cutting Wheel Diameter:12". Cutting Wheel Speed (RPM):4,500. Sectioning Capacity:12½" Deep or 3.75" x 4"H. 230V, 3Ph, 60Hz, 17A

Now (USD): $7,500.00

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Used Aremco Accu-Cut 5200

Inventory Number: 61730
Now (USD): $6,500.00

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

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Used Ultron UH115

Inventory Number: 64246
Now (USD): $5,500.00

Ultron UH115 Semiautomatic Wafer Frame Film Mounter. The Model UH115 features a semiautomatic one-pass lamination which provides an extra margin of safety when mounting particularly fragile wafers/substrates. Bubble free film lamination. Static Ionization Bar with power safety interlock. Does not come with Take-up roller assembly option. Edge-Contact Workstage for 6" wafers. 115V, 1PH, 50/60Hz, 3A

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Used K&S 961

Inventory Number: 64300
Now (USD): $5,950.00

K&S 961 Wafer Tape Frame Mounter. The K&S Model 961 Wafer Mounting Station enables the mounting of wafers up to 8 inches in diameter. This mounting station is compatible with standard or interleaved UV-curable tape, and contains a vacuum stage wafer hold-down for holding the wafer in position during mounting. A programmable heating stage heats the tape to attain uniform tensioning, the adjustable spring loaded plate ensures optimal contact pressure and a built-in tape cutter facilitates mounted piece extraction. Includes optional static eliminator and tape backing removal assembly. 110V, 50/60Hz, 5A

Product Details

Used Allied High Tech Tech Cut

Inventory Number: 64324
Now (USD): $4,950.00

ALLIED HIGH TECH TECH CUT. Variable Speed Sectioning Saw for Precision Sample Preparation.Variable Blade Speed: 100 to 4000 rpm. Dual Cutting Modes: Constant sample advancement or preset sample load. Automatic sample advancement adjustable rate from 0.15” per min. to 1.50” per min. Auto table retraction after sectioning. 115V, 60 Hz, 3.5A

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Used Scifab Series 1000

Inventory Number: 64343
Now (USD): $3,500.00

Scifab Series 1000 Deluxe Hard Tissue Microtome.

Product Details

Used Disco DAD-2H/6TM

Inventory Number: 64390
Now (USD): $6,500.00

Disco DAD-2H/6TM Precision Dicing Saw. Can select round or square cut configurations when dicing wafers up to 6” in automatic or manual modes.
Fully programmable. High frequency air spindle variable speed from 10,000 to 40,000 rpm. 360° motor controlled theta  rotation. High precision camera and monitor for easy alignment. OLDER DICING SAW BUT SOLD TESTED AND WORKING!

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Used Ultron Systems UH114-8

Inventory Number: 64460
Now (USD): $4,950.00

ULTRON UH114-8 Wafer/Frame Film Applicator. Uniform bubble-free adhesion. Temperature controlled wafer stage. Operates with backed or non-backed films. Wafer chuck for up to 8” dia. wafers. 115V, 50/60 Hz, 3A

Product Details

Used Buehler Ecomet Polishing Table

Inventory Number: 64497
Now (USD): $5,950.00

Buehler Ecomet Dual Wheel Polishing/Grinding Table. Two 8" variable speed polishing/grinding stations mounted in a table. Each unit functions separately. Speed variable from 50 to 500 RPM. Each station has a sink with faucet for cleaning. Table dimensions 54"L x 31"W x 30"H. 100-115V, 50/60Hz, 15A

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