Equipment Photos

Equipment Details

Inventory Number: 57598
Category: Bonders - Welders
Manufacturer: Orthodyne

Ultrasonic Heavy Wire Wedge Bonder. Configured for ribbon wire. Semiautomatic operation, automatic adjustable looping and stepback produce uniform loop heights for more consistent, higher quality bonds. Wire Size: Capable of 4 to 20 mil with appropriate wedge tool. 115V, 50/60 Hz.

Now (USD): $6,500.00

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Product Details

Used Laurier SA-202

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Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.

Product Details

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Megasonic Wafer Cleaning System. Robot assist between 2 tanks. Set up for 2 - 200 mm cassettes. Tank 1: 11 in. L x 20 in. W x 15 in. H is a quartz megasonic tank with 3 - 600W KAJO megasonic generators. Tank 2: 12 in. L x 20 in. W x 14 in. H is a YieldUp dryer tank with N2 purge and gas injection capability. Overall Dimensions: 60 in. L x 60 in. W x 88 in. H. Mfg. Date: 12/97.

Product Details

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Product Details

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Ultrasonic IPA Degreasing, Cleaning and Drying System. Used to degrease, clean and dry printed circuit board and hybrid assemblies using isopropyl alcohol as the cleaning solvent. Fully automatic PLC controller and can be set up to perform a variety of multiple step processes. Includes ultrasonic agitation option and spray option. Tank Size Below Cooling Coils: 20.5 in. L x 11.5 in. W x 17 in. D. 208V, 3 Ph, 50/60 Hz.

Product Details

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Product Details

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Inventory Number: 57715
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Large Vacuum Chamber. Inside Chamber Size: 54 in. W x 54 in. H x 40 in. D. Empty chamber, no pumps. Sold As Is.

Product Details

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Product Details

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Product Details