Equipment Photos

Equipment Details

Inventory Number: 55954
Category: Bonders - Welders
Manufacturer: MRSI

MRSI 505 Assembly Work Cell. Ultra-precise, high speed, vision guided, flexible, inline. Large work surface accommodates most input and output options. Pick and place. Inspection station with bottom mounted camera, looks like flip chip? Call for additional photos. Sold As Is.

Now (USD): $15,000.00

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Used Uvexs 15053 CCU

Inventory Number: 59828
Now (USD): $3,250.00

Uvexs 15053 CCU Tabletop UV Curing System. Adjustable belt speed. Adjustable power levels: 150, 200, 300W/inch. UV lamp hour meter. Belt: 54” L x 6” W. 120V, 60 Hz, 20A.  FULLY TESTED AND READY TO SHIP!

Product Details

Used Control Micro Systems CMS5050Y

Inventory Number: 56703
Now (USD): $3,950.00

Control Micro Systems CMS5050Y In-Line PC Board Laser Marking System. Features 20W diode pumped internally cooled Nd YAG laser. 16 bit high precision galvanometer system. 6-inch high precision marking lens. LaserGraf 32 with Windows® 2000 OS. Flat panel computer monitor with Ergotron arm. Integrated barcode reader with database implementation. Adjustable width, in-line conveyor. Compliance with SMEMA specification 1.2. CDRH Class 1 enclosure. Fume extraction system. Date of Mfg.: 2004. Sold As Is.

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Used Wavelength Electronics LFI-4505

Inventory Number: 55673
Now (USD): $695.00

Wavelength Electronics LFI-4505 Laser Diode Driver. 500mA laser diode driver. Low noise, stable current source. Constant current and constant power control modes. 115V, 230V, 50/60 Hz, CE.

Product Details

Used Avio PHU-10

Inventory Number: 52634
Now (USD): $950.00

Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

Product Details

Used Semiconductor Equipment Corp. 410

Inventory Number: 52745
Now (USD): $29,000.00

Semiconductor Equipment Corp. 410 Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

Product Details

Used Laurier SA-202

Inventory Number: 53582
Now (USD): $3,950.00

Laurier SA-202 Epoxy Die Bonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.

Product Details

Used Laurier SA-202

Inventory Number: 53779
Now (USD): $3,950.00

Laurier SA-202 Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.

Product Details

Used Laurier CP-222

Inventory Number: 49910
Now (USD): $3,950.00

Laurier CP-222 Chip Placement System for use with Pre-Screened Adhesives. Ideal for LED’s and multiple chip placement on hybrids where epoxies or gold pastes are prescreened on the substrate.

Product Details

Used Leko L930U

Inventory Number: 60373
Now (USD): $4,950.00

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

Product Details

Used Ohashi CAJR-02SDPX

Inventory Number: 60383
Now (USD): $12,000.00

Ohashi CAJR-02SDPX Tabletop Chip Alignment System for LCD or FPC. Aligns and mounts IC chips onto a position of LCD or FPC. Date of Mfg.: 9/2010.

Product Details