Equipment Photos

Equipment Details

Inventory Number: 61271
Category: Exposure - Mask Aligners - UV Curing
Manufacturer: Suss Microtec

Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 μm, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment. The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm. Features and Benefits: Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface.Printing Modes: UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.8 micrometers. UV300: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6.

Now (USD): $59,000.00

Products Similar to: Suss Microtec MJB4

Used Suss Microtec MJB4

Inventory Number: 60960
Now (USD): $59,000.00

Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 micrometers, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment.

Features and Benefits:
Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates).
Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator.
Ergonomic operation. Touch panel graphical user interface.

Printing Modes:
UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.8 micrometers.
UV300: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6 micrometers.

The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.

Product Details

Used Suss Microtec MJB4

Inventory Number: 62104
Now (USD): $59,000.00

Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 μm, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment.

Features and Benefits:
Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface.
Printing Modes:
UV400: Soft Contact 2.0µm. Hard Contact 1.0µm.
Vacuum Contact less than 0.8µm.
UV300: Soft Contact 2.0µm. Hard Contact 1.0µm.
Vacuum Contact less than 0.6µm.

The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 deg . Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.

The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.

Product Details

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Product Details