Equipment Photos

Equipment Details

Inventory Number: 60960
Category: Exposure - Mask Aligners - UV Curing
Manufacturer: Suss Microtec

Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 micrometers, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment.

Features and Benefits:
Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates).
Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator.
Ergonomic operation. Touch panel graphical user interface.

Printing Modes:
UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.8 micrometers.
UV300: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6 micrometers.

The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.

Now (USD): $59,000.00

Products Similar to: Suss Microtec MJB4

Used Suss Microtec MJB4

Inventory Number: 61271
Now (USD): $59,000.00

Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 μm, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment. The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm. Features and Benefits: Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface.Printing Modes: UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.8 micrometers. UV300: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6.

Product Details

Used Suss Microtec MJB4

Inventory Number: 62104
Now (USD): $59,000.00

Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 μm, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment.

Features and Benefits:
Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface.
Printing Modes:
UV400: Soft Contact 2.0µm. Hard Contact 1.0µm.
Vacuum Contact less than 0.8µm.
UV300: Soft Contact 2.0µm. Hard Contact 1.0µm.
Vacuum Contact less than 0.6µm.

The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 deg . Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.

The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.

Product Details

Used Canon Gap Set Tool

Inventory Number: 49743
Now (USD): $500.00

Used on Canon PLA-501 Series mask aligners.

Product Details

Used Macam UVLS202810002

Inventory Number: 51608
Now (USD): $450.00

Flexicure UV Adhesive Curing System. Developed to accelerate the curing process of UV adhesives for component bonding, sealing and protection. 2 outputs but only 1 flexible cable.

Product Details

Used Karl Suss MA6

Inventory Number: 56345
Now (USD): $49,000.00

Mask Aligner. Resolution into the submicron region. Silicon and compound semiconductor wafers up to 150mm dia. Wafer size determined by mask and chuck size chosen. Ask salesman for sizes available. Split field alignment microscope. CIC500 500W lamp power supply. Wavelength: 360nm to 400nm. Currently configured for topside alignment only.

Product Details

Used Canon PLA 501F

Inventory Number: 56463
Now (USD): $2,950.00

Neutronix Remanufactured Manually Loaded Mask Aligner. Parallel light mask aligner. Can be configured for proximity or contact alignment. 4-1/4 in. x 4-1/4 in. square vacuum chuck. Manual load station for wafers up to 4 in. dia. 250W lamp. 115V, 60 Hz. Sold As Is. Not tested.

Product Details

Used Tamarack 152R 1000-9

Inventory Number: 56757
Now (USD): $21,500.00

Mask Alignment and Exposure System. Split field alignment with twin video cameras equipped with zoom lenses. Controlled collimation exposures. Nitrogen purge. Proximity printing. Soft contact control. Currently configured with 3-3/8 in. x 3-3/8 in. vacuum chuck and 5 in. mask. Other sizes can be purchased from manufacturer. 500/1000W UV light source. 115V, 60 Hz.

Product Details

Used Tamarack 152P/162

Inventory Number: 56766
Now (USD): $14,950.00

Projection Mask Aligner. For thin film alignment and expose on ceramic, silicon, metal or glass substrates with diagonals or diameters of up to 6 in. Through-the-lens alignment. 4 to 8 mils depth of focus. 1:1 projection. 1000W lamp maximum. Wavelength Range: 350 to 450nm. Resolution: 15 to 25 microns.

Product Details

Used Karl Suss MA150M

Inventory Number: 57801
Now (USD): $39,000.00

Mask Aligner with Manual Substrate Handling. Contact or proximity mask aligner. Manual substrate loading of wafers, partial wafers, substrate and special material processing. Lamp housing and power supply capable of using UV lamps up to 1000W 365-400nm. Capable of exposing substrates up to 150mm with appropriate chuck and mask option. Currently configured for 4 in. dia. wafers. Call for As Is price.

Product Details

Used Karl Suss MJB3-IR

Inventory Number: 51506
Now (USD): Contact for Price

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR KARL SUSS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Mask Aligner with Backside and Topside Alignment Capabilities. The scanning backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The alignment microscope uses 5X, 10X and 20X objective lenses for either backside or topside alignment. For topside alignment the eyepieces are 12.5X. The exposure source is a 350W Hg lamp powered by a Suss Model 505 supply. The system incorporates UV-400 optics to transfer the energy to the substrate. The substrate may be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision “HP”) is available.

Product Details