Used Karl Suss MJB3-IR

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR KARL SUSS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Mask Aligner with Backside and Topside Alignment Capabilities. The scanning backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The alignment microscope uses 5X, 10X and 20X objective lenses for either backside or topside alignment. For topside alignment the eyepieces are 12.5X. The exposure source is a 350W Hg lamp powered by a Suss Model 505 supply. The system incorporates UV-400 optics to transfer the energy to the substrate. The substrate may be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision “HP”) is available.

Mask Aligner with Backside and Topside Alignment Capabilities. The scanning backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. Olympus microscope. The alignment microscope uses 5X, 10X, 20X and 50X objective lenses for either backside or topside alignment. For topside alignment the eyepieces are 10X. The exposure source is a 350W Hg lamp powered by a Suss Model CIC 500. The system incorporates UV-400 optics to transfer the energy to the substrate. The substrate may be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision“HP”) is available. Wavelength: 365nm, 405nm. 115-230V, 50/60 Hz. Very Nice Condition.

Used on Canon PLA-501 Series mask aligners.

Flexicure UV Adhesive Curing System. Developed to accelerate the curing process of UV adhesives for component bonding, sealing and protection. 2 outputs but only 1 flexible cable.

Neutronix Remanufactured Manually Loaded Mask Aligner. Parallel light mask aligner. Can be configured for proximity or contact alignment. 4-1/4 in. x 4-1/4 in. square vacuum chuck. Manual load station for wafers up to 4 in. dia. 250W lamp. 115V, 60 Hz. Sold As Is. Not tested.

Mask Alignment and Exposure System. Split field alignment with twin video cameras equipped with zoom lenses. Controlled collimation exposures. Nitrogen purge. Proximity printing. Soft contact control. Currently configured with 3-3/8 in. x 3-3/8 in. vacuum chuck and 5 in. mask. Other sizes can be purchased from manufacturer. 500/1000W UV light source. 115V, 60 Hz.

Projection Mask Aligner. For thin film alignment and expose on ceramic, silicon, metal or glass substrates with diagonals or diameters of up to 6 in. Through-the-lens alignment. 4 to 8 mils depth of focus. 1:1 projection. 1000W lamp maximum. Wavelength Range: 350 to 450nm. Resolution: 15 to 25 microns.

Mask Aligner with Manual Substrate Handling. Contact or proximity mask aligner. Manual substrate loading of wafers, partial wafers, substrate and special material processing. Lamp housing and power supply capable of using UV lamps up to 1000W 365-400nm. Capable of exposing substrates up to 150mm with appropriate chuck and mask option. Currently configured for 4 in. dia. wafers. Call for As Is price.

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR KARL SUSS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Mask Aligner with Backside and Topside Alignment Capabilities. The scanning backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The alignment microscope uses 5X, 10X and 20X objective lenses for either backside or topside alignment. For topside alignment the eyepieces are 12.5X. The exposure source is a 350W Hg lamp powered by a Suss Model 505 supply. The system incorporates UV-400 optics to transfer the energy to the substrate. The substrate may be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision “HP”) is available.

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR KARL SUSS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Large Gap Mask Aligner. System is in the MA6 configuration with top side alignment. Designed to align wafer to mask with separations of up to 300 micrometers using the included Frame Grabber option. Has proximity, contact and hard contact modes. Mask holders available are 5 in. x 5 in. or 6 in. x 6 in. Manual load and align will handle 3 in. to 6 in. wafers. Uses wedge error compensation on chuck for all modes of exposure. Has single or multiple exposure modes. 500 Watt Hg Lamp powered by Karl Suss CIC500 supply.