Used Logitech VS2

Tokyo Seimitsu S-LM-116G Vertical Slicing Machine with ID Diamond Blade. Electronically controlled slicing machine produces quality wafers by precisely cutting an ingot of brittle materials with an ID diamond blade. Blade size OD: 422 mm, ID: 152 mm. Acceptable Ingot Size: Max. 100 mm x 350 mm L. Includes oil mist separator. 220V, 3 Ph, 60 Hz.

Seiko Instruments OFL-11 Triple Platen Fiber Optic Polisher. 3 station optical fiber polisher. 100V, 50/60 Hz.

Speedfam CHEK-FLAT Optical Flatness Measuring System. Devised for optically measuring flatness on non-reflective surfaces in the problem range of 0.0001 in. to .100 in. Without fixturing or calibration, the unique Chek-Flat pattern shows where and by how much a surface is out-of-flat. No anvils.

Logitech LP30 Precision Polishing Systems. 30 cm dia. polishing plate. Lot of 2.

Advanced Imaging Inc. ROBO 4 15 in. Polishing System. PC controller 3.5 in. floppy. 15 in. dia. polishing plate with 8 in. dia. center hole. Swing out polishing jig. Single ring type holder C shaped. 120V, 60 Hz.

Advanced Imaging Inc. Rough Lap Station Polishing System. Heavy duty polishing system. 18 in. dia. polishing wheel capable of holding 4 specimen rings. Digital RPM readout. Motor timer. 115V, 60 Hz.

Leco PR-35 Automatic Dual Mount Dual Mold Pneumatic Sample Mounting Press. Two sample mounting presses in one package. Mold diameter: 2 in. Thermostatically controlled heater with integral water cooler. Direct reading pressure gauge. Additional 1-1/4 in. heater molding head. 230V, 1 Ph, 50/60 Hz, 11A.

Logitech 1PM42 PM4 Precision Lapping and Polishing Machine. Integral abrasive autofeed system ensures a controlled flow of abrasive slurry to the lapping plate. Convenient touch panel controls all machine functions. Plate speed variable from 0 to 70 rpm. Timer can be set to run machine for up to 10 hours. Eccentric drive to reciprocate the specimen across the plate. Sweep speed variable from 0 to 45 cycles per minute. 110V, 60 Hz, 3A.

Strasbaugh 6BA-3 Polishing System. 26-inch dia. polishing plate with three stations for holding polishing rings. No rings included. Variable Speed: 25 to 75 rpm.

Logitech 1WBS4 Wafer Substrate Bonding Unit. For temporary wax mounting of wafers for lapping or polishing. Single station bonder. Automated process cycle minimizes operator involvement. Excellent wafer to support disk parallelism. Bubble free bond. 4-inch diameter capacity. Can be programmed to bond samples over a wide range of temperature and applied load.