Equipment Photos

Equipment Details

Inventory Number: 58267
Category: Wafer Analysis
Manufacturer: Gaertner

Multiwavelength 200mm Ellipsometer. Has a software disk but no cables or controls. Missing computer and stage driver. Two wavelength ellipsometers use additional laser sources to analyze difficult films. 8 in. dia. stage with motorized stage, no controller. Sold As Is with 30 day ROR.

Now (USD): $950.00

Products Similar to: Gaertner L2W16D.830

Used August Technology NSX-85

Inventory Number: 57564
Now (USD): $45,000.00

Automated Defect Inspection System. Inspection of whole wafers, sawn wafers, JEDEC trays, Auer boats, die in gel/waffle paks, MCM’s. Detects defects down to 0.5 micron. Automated wafer mapping and identification. Automated data collection and reporting. Menu-based, easy to use Windows environment. 200-240V, 1 Ph, 50/60 Hz, 5A, CE.

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Used Cyberoptics Cyberscan 200

Inventory Number: 50584
Now (USD): $4,950.00

Non-Contact Profile Measurement System. Uses laser triangulation to analyze two dimensional data. Non-contact measurement allows you to work with wet and fragile samples. PC controller analyzes data. Motorized stage. 120V, 60 Hz.

Product Details

Used Daini Seikosha SFT/156

Inventory Number: 34297
Now (USD): $250.00

Fluorescent X-Ray Measurement System. X-Y Stage: 3 in. x 3 in. Travel Z. Adjustment: 1.3 in. Min. Measurement area: .005 in. Sold AS IS.

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Used Wyko BP2000W

Inventory Number: 39319
Now (USD): $39,000.00

Bump Measurement Profiling System. The right inspection tool for flip-chip process control. Repeatably measures solder bump heights, from 150 micro-meters or more for standard flip-chip bumps down to a few microns for under-bump metalization pads, as well as provides volume data on all bump sizes. Non-contact 3-D data on all size bumps over the entire wafer. The system calculates bump height, width, volume and coplanarity. Automatically detects bump position, solder bridges, and missing and extra solder bumps, with prominent display of pass/fail results and position statistics at the bump, die,wafer and lot level. Powerful measurement analysis, generating output as 2-D cross sections, contour plots, bearing ratio plots, or 3-D images. A built in Wizard allows quick measurement set-up.

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Used Tencor SURFSCAN AIT Model 8010

Inventory Number: 40884
Now (USD): $29,000.00

Advanced In-Line Defect Inspection System. Automated full wafer inspection system for detecting particles as small as 0.10 micro-meters on bare silicon and patterned process wafers. High detection sensitivity even for difficult after-etch, develop, and chemical mechanical polishing. High throughput of up to 30 full wafer scans per hour on 200mm wafers.

Product Details

Used Zygo SXM300

Inventory Number: 46204
Now (USD): $12,500.00

Multimode Scanning Probe Microscope. The Magnascope SXM300 is a multimode probe microscope that measures sub-micron features to near angstrom-level resolution. It is designed for critical-dimension measurements of height, width, roughness and sidewall angles of 300mm wafers and masks of up to 9 in x 9 in. Sold As Is.

Product Details

Used Philips PLM-100

Inventory Number: 48787
Now (USD): $22,500.00

Photoluminescence Mapping Tool. For process control, analysis of band-gap, ternary layer composition, layer thickness and crystal perfection.

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Used GSI Lumonics VOY 1212

Inventory Number: 47972
Now (USD): $8,500.00

High Performance Non-Contact Metrology System. Fully automatic. Windows® operating system. Easy to program and use. Powerful view metrology software. Measuring Range: 300 x 300 x 150mm. 115V, 50/60 Hz, 15A.

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Used Zygo 5600

Inventory Number: 29714
Now (USD): $2,500.00

Maxim 3D Laser Interferometric Microscope. PARTS SYSTEM.

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Used CDE Resmap 178

Inventory Number: 55143
Now (USD): Contact for Price

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR CDE SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Four Point Probe Resistivity Measurement System. Four point probe system for mapping resistivity on substrates from 2 in. to 8 in. dia. Manual loading of subtrates. Measurement Range: 2 milliohms/sq. to 5 megaohms/sq. Polar maps, rectangular maps, line scan or user defined patterns. 115/230V, 60 Hz.

Product Details