Used Buehler ISOMET 4000

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Ultron UH115 Semiautomatic Wafer Frame Film Mounter. The Model UH115 features a semiautomatic one-pass lamination which provides an extra margin of safety when mounting particularly fragile wafers/substrates. Bubble free film lamination. Static Ionization Bar with power safety interlock. Does not come with Take-up roller assembly option. Edge-Contact Workstage for 6" wafers. 115V, 1PH, 50/60Hz, 3A

Scifab Series 1000 Deluxe Hard Tissue Microtome.

Pace Technologies Variable Speed Wafering Saw. The PICO-155S is a variable speed precision wafering saw designed to section material with extreme accuracy. Its innovative
design ensures you are cutting with micrometer precision for a wide range of materials including metals, ceramics, electronics, and
other engineered materials.
The microprocessor-controlled system of the PICO-155S guarantees consistent and accurate cutting performance. Efficient cooling
during the cutting process prevents heat-related damage to the specimens, and a digital feedback speed control allows users to
adjust the cutting speed precisely according to their requirements.
Controlling the PICO-155S is a breeze with its user-friendly touchscreen control interface. The LED digital display provides clear
and real-time feedback on the cutting parameters, ensuring optimal control throughout the operation.110V, 50/60Hz

SPECIFICATION PICO-155S
Coolant Built-in Pump
Cutting capacity 2-inch (50 mm)
Cutting speed 300-1500 rpm
Cutting load Variable up to 1500 grams
Positioning range (x-axis) 1-inch (25 mm)
Wheel size Minimum: 3-inch (75 mm)
Maximum: 7-inch (175 mm)

Buehler Vanguard® 2000 Fully Automatic Grinding-Polishing System. Fully automated means that samples can be prepared from start to finish without continuous operator involvement. Just load up to six samples at a time, select the preparation method, and step away. In as little as 15 to 20 minutes your samples will be finished; cleaned, dried, and ready for analysis. The Buehler Vanguard 2000’s microprocessor based system allows the user to select from six preinstalled methods or up to 44 individually created preparation methods.  After the method is started, the robotic arm automatically loads one of six selected platens onto the grinding-polishing base. Next, the automatic head places the samples on the platen while providing single or central load application. A fully integrated dispensing system automatically doses abrasive suspensions onto the  grinding/polishing surface.

Buehler Metaserv 3000 Polisher Grinder with Vector LC Power Head. Buehler Metaserv 3000 single plate automatic polishing machine with 200mm platen for the polishing of metallurgical samples. The Buehler polisher for preparation of metallurgical samples is manufactured for robust mineral composite offer low vibration and resistance to corrosion. A high specification grinder polishing machine for preparation of multiple and single samples. The MetaServ 3000 features an infinitely variable speed control of 50 to 500 rpm. The Vector LC Power Head is an easy to operate, economical power head with basic features for low volume applications. Single sample pressure prepares one to four samples and allows pressure to be tailored for each sample. 120V, 50/60Hz, 3.5A