Equipment Photos

Equipment Details

Inventory Number: 63085
Category: Dicing Saws-Scribers
Manufacturer: Buehler

Precision Linear Sectioning Saw. Designed for cutting various types of materials with minimal sample deformation. Precision sectioning tool capable of cutting virtually any material. Easy to read liquid crystal display. Manual 1 micron sample positioning. Linear feed mechanism. User selectable feed rate allows even the most delicate samples to be cut without deformation. Blade Speed: 200 to 5000 rpm. Wafer blade diameters from 3 in. to 8 in. capable. 85-264V, 50/60 Hz, 1 Ph, CE.

Now (USD): $4,950.00

Products Similar to: Buehler Isomet 4000

Used Disco DAC-2SP/86

Inventory Number: 38633
Now (USD): $12,500.00

Automated Dicing Saw. Max. Substrate Size: 150 mm. Range of Indexing: 0.0001 to 99.9999 mm. Minimum Step Indexing: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm. Older dicing saw but in good condition.

Product Details

Used SAS PACM 250

Inventory Number: 47124
Now (USD): $6,500.00

Hard Material Dicing Saw. Diamond wheel cuts material on a 6 in. dia. vacuum chuck. Digital readout of X and Y axis. Manual control of index. Motorized cut feed. 200/220V, 3 Ph, 60 Hz.

Product Details

Used K&S 984-6

Inventory Number: 56722
Now (USD): $21,500.00

Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.

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Used K&S Spindle

Inventory Number: 57218
Now (USD): $2,500.00

984 Dicing Saw 4 inch Spindle. Rebuilt.

Product Details

Used K&S 7100 AD

Inventory Number: 56732
Now (USD): $25,000.00

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

Product Details

Used Loomis LSD-100

Inventory Number: 53881
Now (USD): Contact for Price

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR LOOMIS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Precision Scriber Breaker. Roller style breaker. Motorized X-Axis control, 0.5 micron positioning resolution. Motorized rotation control. 4 in. wafer capability. Windows® operating system. Color camera. 100/240V, 1 Ph, 50/60 Hz.

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Used Disco DAD522

Inventory Number: 58774
Now (USD): $17,000.00

Precision Automatic Wafer Dicing Saw. Extra-high precision automatic cutting saw for cutting materials such as silicon wafers, glass and small electronic parts made of ceramic. Work Piece Size: 152mm. Theta Axis Rotation: 380 degrees. Dual objective split image microscope. 1.5 kW Synchro Spindle™. Requires house air and water. 200V, 3 Ph, 50/60 Hz.

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Used MTI NSX 250

Inventory Number: 58912
Now (USD): $21,000.00

Dicing System. Unparalleled machine rigidity, a unique overarm spindle support. Three layers of vibration isolation, Windows™ based CNC controls. For dicing silicon, gallium arsenide, glass, ceramics and other brittle materials. 2 in. air bearing spindle up to 40,000 rpm. 6 in. dia. vacuum chuck. 208V, 3 Ph, 50/60 Hz.

Product Details

Used ADT Advanced Dicing Technologies 982-6

Inventory Number: 54731
Now (USD): $15,000.00

Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck. Air bearing spindle with 2 in. dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting. Date of Mfg.: 9/2004.

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Used Micro Automation M3600

Inventory Number: 39015
Now (USD): $3,250.00

Tape Frame Applicator with Camera and Monitor for Alignment. Vacuum hold down of wafers up to 6 in. dia. Roller applies pressure to tape frame to remove bubbles and help with adhesion.

Product Details