Used Layton Technologies IMMASYS FS2012

EDC 100 Exclusive Design Co. Rigid Disk Cleaning System. Uses brushes and surfactant to scrub disks. LCD display. Analog control of scrub/rinse speed and spin dry speed. 115V, 60 Hz.

Baron Blakeslee MLR-120LE-DS/ATH-35 SPL Bi-solvent Vapor Degreaser System. Equipment designed for Kyzen DA3520 Bi-solvent and Novec 71IPA solvent. Configured with one DA3520 immersion pre-clean tank and one solvent degreaser tank.  

MLR-120LE Solvent Degreaser:
125 percent Freeboard. 4 side tank insulation. All solvent wetted parts of stainless steel T-304 or greater. Magnetic drive spray pump with foot switch operated spray lance will allow you to manually clean your oversized PCB assemblies. Magnetic drive recirculation pump and filtration system. 10 micron cartridge filter. Aluminum motorized roll up cover. 
Stainless steel T-304 water separator. Stainless steel cooling coils Hot Gas Bypass. VaporTrap™. Solvent vapor control (shuts off heat if primary refrigeration fails). High temperature control (prevents heater burnout). Digital liquid temperature control (controls solvent boiling temperature). Low Level Control (shuts off heat if solvent level falls to low). Vapor Up Control (prevents use of spray lance unless vapor zone is fully established). 

Working Dimensions:
Vapor Zone: 20 in. L x (L to R) x 12 in. W (front to back) x 10 in. H vapor zone.
Rinse Sump: 10 in. L x (L to R) x 12 in. W (front to back) x 10 in. H liquid level.

Baron Blakeslee Model ATH-35 SPL: 
Automatic Transporter/Hoist: This Hoist is a cantilevered type, two (2) dimensional material handling system. The transporter system consists of a cantilevered winch package system and support structure. It also includes control box and remote emergency stop button.

A2 DA3520 Immersion Pre-Clean Tank: 
Working Dimensions: 21 in. L (L to R) x 12 in. W 
(front to back) x 10 in. immersion.
Freeboard: 5 in. H.
Heat Input: 1.5kW.
Power Supply: 240VAC, 1 Ph, 60 Hz.
Total Operational Solvent Fill: 14 Gallons.

NEW Never Installed, was $75,000 New

Ultron UH117 Wafer Cleaning System. Ultron Systems' Model UH117 Wafer Cleaning System provides an ideal solution for cleaning wafers after sawing or scribing. Operation is semiautomatic and fully programmable via the new touchscreen LCD panel. Microprocessor control ensures precise, flexible, uniform, and repeatable cleaning. Up to 10 programs can be stored for different processes. Each program may have up to 99 different cleaning/rinsing/drying steps with a maximum of 999 seconds per step. The unit is capable of cleaning wafers up to 8-inches in diameter or up to 6-inches in diameter mounted on a film frame or grip ring. An optional liquid additive injection feature is available to facilitate the cleaning cycles. Both hot and cool dry modes are available for faster, more efficient drying.

Currently has 5” dia. chuck. 115V, 50/60 Hz, 5A