Used Vacuum Atmospheres HE-243-XW

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR VACUUM ATMOSPHERES SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Glove Box System with CS 40 Refrigerator option. Standard single person glove box with 15 in. dia. antechamber and 6 in. dia. mini-antechamber. Industrial computer for monitoring and control. Single purifer with 0 to 40 cfm blower and isolation valves. System does not have moisture or oxygen monitoring. Cold storage refrigerator assembly provides immediate access from inside of glove box.

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR MBRAUN SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Glove Box Workstation. PLC controlled with color touch panel. Single gas purifier with blower. Stainless steel box with antechamber and mini antechamber. Oxygen monitor. Moisture monitor.

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR SIKAMA SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Multi-Purpose Reflow Soldering System. Heated Zones: 4. Cooling Zones: 1. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 208/230V, 50/60 Hz.

Hybrid Package Cover Remover. Designed to efficiently remove seam welded covers from flat or plug-in type microelectronic packages up to 3 in. x 3 in. in a manner which allows rewelding of new cover. 115V, 60 Hz, 10A.  No longer made.

Hybrid Package Cover Remover. Designed to efficiently remove seam welded covers from flat (butterfly) or plug-in type microelectronics packages up to 3 in. x 3 in. in a manner which allows rewelding of a new cover without the need for further package surface finishing. 115V, 60 Hz, 10A. No longer made.

Glove Box. Stainless steel construction. Antechamber with a vacuum pump. DRI-TRAIN gas purifier. Duplex outlet inside. Pedatrol pressure control. Overhead light. Unit has older oxygen and moisture analyzers but these will not be tested or refurbished at this price. Units will probably need new cells.

Hot Bar Solder Reflow System. Digital programmable controller PM4B, 1-231-03. 115V, 50/60 Hz.

Controlled Atmosphere Glove Box with Moisture and Oxygen Monitors. Nexus instrumentation computer that monitors and controls system through an easy to use menu driven interface. Stainless steel construction. Moisture and trace oxygen analyzers. 15-inch dia. antechamber and 6-inch dia. mini-antechamber. Vacuum pump. Dri-Train with blower. Bed media will be replaced during refurbishment. Fluorescent lights. Adjustable shelves. Vac thermocup cold well.

Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

Heat Bonding Machine for Thermocompression Bonding. Can be used for thermocompression bonding, hot melting and heat forming technics, blanching and heat form plastic cement, mucilage glue and sponge etc. Features constant heat mode. Variety of sizes of heating bonding blades available. Max. Temp.: 300 deg C. Timer: 1 to 30 secs. Pressure Range: 25 to 100 Kgf/cm2. 110V, 50/60 Hz.