Equipment Photos

Equipment Details

Inventory Number: 58774
Category: Dicing Saws-Scribers
Manufacturer: Disco

Precision Automatic Wafer Dicing Saw. Extra-high precision automatic cutting saw for cutting materials such as silicon wafers, glass and small electronic parts made of ceramic. Work Piece Size: 152mm. Theta Axis Rotation: 380 degrees. Dual objective split image microscope. 1.5 kW Synchro Spindle™. Requires house air and water. 200V, 3 Ph, 50/60 Hz.

Now (USD): $17,000.00

Products Similar to: Disco DAD522

Used Disco DAC-2SP/86

Inventory Number: 38633
Now (USD): $12,500.00

Automated Dicing Saw. Max. Substrate Size: 150 mm. Range of Indexing: 0.0001 to 99.9999 mm. Minimum Step Indexing: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm. Older dicing saw but in good condition.

Product Details

Used SAS PACM 250

Inventory Number: 47124
Now (USD): $6,500.00

Hard Material Dicing Saw. Diamond wheel cuts material on a 6 in. dia. vacuum chuck. Digital readout of X and Y axis. Manual control of index. Motorized cut feed. 200/220V, 3 Ph, 60 Hz.

Product Details

Used K&S 984-6

Inventory Number: 56722
Now (USD): $21,500.00

Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.

Product Details

Used K&S Spindle

Inventory Number: 57218
Now (USD): $2,500.00

984 Dicing Saw 4 inch Spindle. Rebuilt.

Product Details

Used K&S 7100 AD

Inventory Number: 56732
Now (USD): $25,000.00

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

Product Details

Used Loomis LSD-100

Inventory Number: 53881
Now (USD): Contact for Price

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR LOOMIS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Precision Scriber Breaker. Roller style breaker. Motorized X-Axis control, 0.5 micron positioning resolution. Motorized rotation control. 4 in. wafer capability. Windows® operating system. Color camera. 100/240V, 1 Ph, 50/60 Hz.

Product Details

Used MTI NSX 250

Inventory Number: 58912
Now (USD): $21,000.00

Dicing System. Unparalleled machine rigidity, a unique overarm spindle support. Three layers of vibration isolation, Windows™ based CNC controls. For dicing silicon, gallium arsenide, glass, ceramics and other brittle materials. 2 in. air bearing spindle up to 40,000 rpm. 6 in. dia. vacuum chuck. 208V, 3 Ph, 50/60 Hz.

Product Details

Used ADT Advanced Dicing Technologies 982-6

Inventory Number: 54731
Now (USD): $15,000.00

Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck. Air bearing spindle with 2 in. dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting. Date of Mfg.: 9/2004.

Product Details

Used Micro Automation M3600

Inventory Number: 39015
Now (USD): $3,250.00

Tape Frame Applicator with Camera and Monitor for Alignment. Vacuum hold down of wafers up to 6 in. dia. Roller applies pressure to tape frame to remove bubbles and help with adhesion.

Product Details

Used Ultron UH 114

Inventory Number: 56085
Now (USD): Contact for Price

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR ULTRON SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Wafer/Frame Film Applicator. Uniform adhesion (no bubbles). Uniform film tension. Temperature controlled wafer stage. Currently configured with 4 in. wafer stage. 120-240V, 1, Ph, 50/60 Hz, 3A.

Product Details