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Equipment Details

Inventory Number: 64390
Category: Dicing Saws-Scribers
Manufacturer: Disco

Disco DAD-2H/6TM Precision Dicing Saw. Can select round or square cut configurations when dicing wafers up to 6” in automatic or manual modes.
Fully programmable. High frequency air spindle variable speed from 10,000 to 40,000 rpm. 360° motor controlled theta  rotation. High precision camera and monitor for easy alignment. OLDER DICING SAW BUT SOLD TESTED AND WORKING!

Now (USD): $6,500.00

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Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

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Used Lintec RAD-2500F/8

Inventory Number: 62399
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Lintec RAD-2500F/8 Fully Automatic Wafer Tape Frame Mounter. Consists of alignment function and tape tension control system which reduces voids at lamination. Currently configured for 200mm wafer size. 8-inch frame table (DTF2-8-1 Disco). Ring frame, heater spec. 6-inch VN wafer and 6-inch wafer cassette compliance. Protrusion sensor. 200-230V, 1 Ph, 50/60 Hz, 8A. Date of Mfg.: 2011.

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Inventory Number: 64246
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Inventory Number: 64300
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