Used Denton Vacuum Carbon Evaporation Accessory

Gencoa Planar Magnetron Cathode. Target Area: 29-1/2 in. x 4-7/8 in. Gas input. With cart for maintenance of cathode.

Gencoa Planar Magnetron Cathode. Magnetron cathode for sputtering over a large area. Target Size: 29-1/2 in. x 4-7/8 in.

Gencoa Planar Magnetron Cathode. Magnetron cathode for sputtering over a large area. Target Size: 29-1/2 in. x 4-7/8 in.

Denton Vacuum Desk IV Standard Sputter Coater for SEM Samples. Provides a uniform, conductive, fine grained coating. Self-contained unit with built-in pump. Advanced design magnetron sputterhead for truly cold sputtering.  Etch mode for sample cleaning.  6” OD pyrex chamber.  Sputters precious metals, no target included. Does not require gas. 120V, 50/60 Hz, 10A

Denton Vacuum Explorer 14 Three Target RF/DC Sputtering System. Includes etch. Vacuum deposition system designed for thin film research applications. Graphic user interface and touch screen control. The system is fully automatic or can be run manually. Features a box coater design that provides easy access to substrates, sources, and instrumentation while maintaining excellent pumping characteristics. System utilizes a turbomolecular high vacuum pump with roughing pump. Three DC/RF magnetron cathodes each with a shutter. Variable source to substrate distance. Cathodes are mounted confocally for sputter down.  Cathode size is approximately 3” dia. Substrate holder 6” dia. Unit is configured with substrate heater. Single MFC gas input. Deposition chamber 14” H x 14” W x 14” D stainless construction. 208V, 50/60Hz, 100A

Denton Infinity 18 Optical Coating Evaporator for Antireflective Coatings. Cryopumped high vacuum system that performs resistive evaporation of silicon monoxide (SiO, Silicon (II) Oxide) films to provide an antireflective coating for backside analysis. The system has an integrated optical monitor to measure the surface reflectance of a silicon witness coupon at a specific wavelength. Pumpdown of the vacuum system can be automatic or manual control, inniation and termination of the deposition cycle are manual. The vacuum, coating power, and optical monitor systems are operated from the touch screen controller panel. The deposition itself is operated from the Telemark 860 Depostion Controller panel. Chamber size 18" x 23" x 36" inside. Includes roughing pump and cryopump compressor. 208V, 3Ph, 50/60Hz, 70A

Denton Vacuum Carbon Coater. Table top self contained unit for coating samples with carbon. Six inch chamber with carbon rod evaporation source and stationary sample holder. Built in vacuum pump and gauges. 110V, 50/60Hz

Denton Vacuum Desk IV Standard Sputter Coater for SEM Samples. Provides a uniform, conductive, fine grained coating. Self-contained unit with built-in pump. Advanced design magnetron sputterhead for truly cold sputtering.  Etch mode for sample cleaning.  6” OD pyrex chamber.  Sputters precious metals, no target included. Does not require gas. 120V, 50/60 Hz, 10A

Denton Vacuum DV-502B High Vacuum Evaporator. Graphic user interface with touch screen. Small compact laboratory sized thermal resistive deposition system. Diffusion and roughing pump in cabinet. 12” dia. x 18” H quartz bell jar with implosion guard and automatic jar lift. The 1 kVA evaporation power supply permits evaporation of most materials used in electron microscope specimen preparation including carbon, gold, gold palladium, platinum, etc., and can handle many of the evaporations required in various metalizing, optical coating and other applications. Currently configured with a single evaporation source but another source can be added at an additional price. 208V, 1Ph, 50/60Hz, 28A

Denton Vacuum Explorer 14 Three Target RF/DC Sputtering System. Includes etch. Vacuum deposition system designed for thin film research applications. Graphic user interface and touch screen control. The system is fully automatic or can be run manually. Features a box coater design that provides easy access to substrates, sources, and instrumentation while maintaining excellent pumping characteristics. System utilizes a turbomolecular high vacuum pump with roughing pump. Three DC/RF magnetron cathodes each with a shutter. Variable source to substrate distance. Cathodes are mounted confocally for sputter down.  Cathode size is approximately 3” dia. Substrate holder 6” dia. Unit is configured with substrate heater. Single MFC gas input. Deposition chamber 14” H x 14” W x 14” D stainless construction. 208V, 50/60Hz, 100A