Used Oxford Instruments 90 Plus RIE

Trion Technology Minilock Single Wafer RIE Etcher. LCD display. Load lock with transfer arm. Current substrate carrier for up to 150mm wafers. Five MFC for gas input. Missing RF generator and vacuum pump. Sold As Is.

March Instruments PX 1000E8 Plasma Asher/Etcher with Pneumatic Vertical Door. Batch system for plasma cleaning or etching. Currently configured with vertical shelves: 18 in. x 6 in. RFX 600 13.56 MHz RF generator. Two gas inputs. Does not include vacuum pump at this price, additional cost depending on type required.

Anatech SP100 Table Top Plasma System. For plasma cleaning of small parts or for modifying surfaces. Digital countdown timer. Analog pressure display. Gas flow with needle valve control. RF Power Source: 100W at 13.56 MHz. Quartz Chamber: 4 in. x 8 in. Includes vacuum pump. 110V, 60 Hz, 10A.

Oxford Plasmalab 800 Plus PECVD Plasma Deposition System

• Plasma Enhanced Chemical Vapor Deposition 
• Automatic pressure control
• Substrate electrode: 460mm with PID control
• Can process wafer pieces
• Shower head gas inlet optimized for PECVD
• 400° C substrate table
• System Computer
• PC control with OPT software under Windows
• System software controls all aspects of machine functionality and control of the process operation
• Production mode: system will perform the following sequence without any operator intervention: chamber pumping, recipe running, chamber venting
• Process chamber includes a window panel giving a view on the process table
• System Chiller
• Edwards IHX 610 Vacuum Pump
• Advanced Energy LF-5 RF Generator
• Power: 208VAC, 3PH, 50/60 HZ
• Gas Box with MKS MFCs consisting of:
• 1)  Gas: CF4
• 2)  Gas: N2
• 3)  Gas: N2O
• 4)  Gas: SiH4
• 5)  Gas: N2
• 6)  Gas: O2 

Samco PC-1100 is a parallel-plate plasma cleaning system designed for surface cleaning of products such as plastic microelectronic packages, liquid crystal display (LCD) substrates and hybrid ICs. The process chamber enables the user to install multiple sample shelves, and the high degree of flexibility in terms of configuration supports the batch processing of a wide degree of products, from small electronic components to large FPD substrates. The PC-1100 provides 3 different processing modes (RIE mode, Plasma mode and downstreatm mode) which enables the user to select the optimum processing environment for the unique needs of each product type. RF Generator 13.56 MHZ 600 Watts with automatching network. Two MFC controlled gas lines. The interior shelves act as anode and cathodes and the plasma type depends on the configuration youput the shelves into. Very large shelves, ground shelf 405 x 410mm, power shelf 350 x 425mm. Extra shelves with system. Oil free dry vacuum pump. 480V, 3Ph, 60Hz, 20A

System provides three modes of operation: RIE, Plasma and Downstream modes.

Process chamber can be configured with multiple large process shelves

Fully automated processing with touch screen controller, can also be run manually

Recipes can be created and stored using the operator interface

Oxford Plasmalab 800 Plus PECVD Plasma Deposition System

• Plasma Enhanced Chemical Vapor Deposition 
• Automatic pressure control
• Substrate electrode: 460mm with PID control
• Can process wafer pieces
• Shower head gas inlet optimized for PECVD
• 400° C substrate table
• System Computer
• PC control with OPT software under Windows
• System software controls all aspects of machine functionality and control of the process operation
• Production mode: system will perform the following sequence without any operator intervention: chamber pumping, recipe running, chamber venting
• Process chamber includes a window panel giving a view on the process table
• System Chiller
• Edwards IHX 610 Vacuum Pump
• Advanced Energy LF-5 RF Generator
• Power: 208VAC, 3PH, 50/60 HZ
• Gas Box with MKS MFCs consisting of:
• 1)  Gas: CF4
• 2)  Gas: N2
• 3)  Gas: N2O
• 4)  Gas: SiH4
• 5)  Gas: N2
• 6)  Gas: O2