Used Oxford Instruments 90 Plus RIE

Trion Technology Minilock Single Wafer RIE Etcher. LCD display. Load lock with transfer arm. Current substrate carrier for up to 150mm wafers. Five MFC for gas input. Missing RF generator and vacuum pump. Sold As Is.

March Instruments PX 1000E8 Plasma Asher/Etcher with Pneumatic Vertical Door. Batch system for plasma cleaning or etching. Currently configured with vertical shelves: 18 in. x 6 in. RFX 600 13.56 MHz RF generator. Two gas inputs. Does not include vacuum pump at this price, additional cost depending on type required.

Anatech SP100 Table Top Plasma System. For plasma cleaning of small parts or for modifying surfaces. Digital countdown timer. Analog pressure display. Gas flow with needle valve control. RF Power Source: 100W at 13.56 MHz. Quartz Chamber: 4 in. x 8 in. Includes vacuum pump. 110V, 60 Hz, 10A.

Plasmatherm SLR-770 ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load lock with wafer transfer robot. Can process wafers from 2” to 8” depending on which process kit is installed. Currently configured with 3” kit. Thermal transfer module for effective cooling of substrate utilizing helium backside thermal transfer in conjunction with computer controlled substrate clamping. High frequency RF-based inductively coupled plasma source capable of high density plasma generation. Closed loop pressure control. Turbo pump with roughing pump. Total of eight MFC gas controllers. Previous gases used N2, O2, CHF3, AR, CH4, CL2, BCL3, CF4. Includes water chiller.

Oxford Plasmalab 800 Plus PECVD Plasma Deposition System

• Plasma Enhanced Chemical Vapor Deposition 
• Automatic pressure control
• Substrate electrode: 460mm with PID control
• Can process wafer pieces
• Shower head gas inlet optimized for PECVD
• 400° C substrate table
• System Computer
• PC control with OPT software under Windows
• System software controls all aspects of machine functionality and control of the process operation
• Production mode: system will perform the following sequence without any operator intervention: chamber pumping, recipe running, chamber venting
• Process chamber includes a window panel giving a view on the process table
• System Chiller
• Edwards IHX 610 Vacuum Pump
• Advanced Energy LF-5 RF Generator
• Power: 208VAC, 3PH, 50/60 HZ
• Gas Box with MKS MFCs consisting of:
• 1)  Gas: CF4
• 2)  Gas: N2
• 3)  Gas: N2O
• 4)  Gas: SiH4
• 5)  Gas: N2
• 6)  Gas: O2 

Oxford Plasmalab 800 Plus PECVD Plasma Deposition System

• Plasma Enhanced Chemical Vapor Deposition 
• Automatic pressure control
• Substrate electrode: 460mm with PID control
• Can process wafer pieces
• Shower head gas inlet optimized for PECVD
• 400° C substrate table
• System Computer
• PC control with OPT software under Windows
• System software controls all aspects of machine functionality and control of the process operation
• Production mode: system will perform the following sequence without any operator intervention: chamber pumping, recipe running, chamber venting
• Process chamber includes a window panel giving a view on the process table
• System Chiller
• Edwards IHX 610 Vacuum Pump
• Advanced Energy LF-5 RF Generator
• Power: 208VAC, 3PH, 50/60 HZ
• Gas Box with MKS MFCs consisting of:
• 1)  Gas: CF4
• 2)  Gas: N2
• 3)  Gas: N2O
• 4)  Gas: SiH4
• 5)  Gas: N2
• 6)  Gas: O2