Bid Service, LLC 225 Willow Brook Rd. Freehold, NJ 07728
Phone: 732-863-9500 Fax: 732-863-1255
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West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope. FULLY TESTED AND READY TO SHIP.
West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. Currently configured for epoxy die bonding. With pickup tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope. Does not include work holders. FULLY TESTED AND READY TO SHIP.
West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope.
Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.
Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S. Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.
Ohashi CAJR-02SDPX Tabletop Chip Alignment System for LCD or FPC. Aligns and mounts IC chips onto a position of LCD or FPC. Date of Mfg.: 9/2010.
Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.
Avio TCW-115A-C TEC Lead Attach Welding System. Avio super welder NA-62D head. Model TCW-115A power supply. Analog power setting. Settings for first heat and second heat time and temperature.
Benchmark System 2000 Seam Sealer Package Welder. As Is, only what is in photo. No power supply or computer.
K&S 4523D Tabletop Digital Manual Wedge Bonder. 200 program storage capacity with 6 independent channels per program. Digital readout of all bonding parameters. Heated work holder has 2 in. x 2 in. work area. StereoZoom 4 microscope. 115V, 50/60 Hz, 4A, CE. FULLY TESTED READY TO SHIP.