Used West Bond 7372B

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope.

Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

Ohashi CAJR-02SDPX Tabletop Chip Alignment System for LCD or FPC. Aligns and mounts IC chips onto a position of LCD or FPC. Date of Mfg.: 9/2010.

Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.

Avio TCW-115A-C TEC Lead Attach Welding System. Avio super welder NA-62D head. Model TCW-115A power supply. Analog power setting. Settings for first heat and second heat time and temperature.

Benchmark System 2000 Seam Sealer Package Welder. As Is, only what is in photo. No power supply or computer.

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope.

XYZTec Condor Sigma LITE Bond Tester. Sigma is the most advanced bond tester.  Sensor accuracy and a future proof, modular design. The Revolving Measurement Unit (RMU) houses up to 6 flexible sensors that are configurable with various pull, peel, push, or shear tools. This enables continuous testing up to 100 kgf. Software comes with the widest range of test sequences. Onboard graphics and intelligent wizards allow easy programming. The software ensures complete documentation of the test protocol, provides preset configurations, and intuitive operator screens. Statistical Process Control (SPC) offers comprehensive statistical information to analyze your production process. This includes different types of graphs to view on screen or to print as reports.

K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discrete devices up to complex hybrid, microwave devices. Built-in programmable negative electronic flame-off system provides ball size fine control and consistency. Does not have Heated work holder. Must purchase separately. Digital logic controls all machine functions, including ball size and tail length. StereoZoom microscope. 115V, 50/60 Hz, 4A, CE. Includes fiber optic spotlight target and lighting option.