Equipment Photos

Equipment Details

Inventory Number: 64375
Category: Bonders - Welders
Manufacturer: Royce

Royce 650 Universal Bond Tester. The Royce 650 Universal Bond Tester offers the most robust selection of capabilities in the Royce bond tester family, from the full range of standard test applications through custom testing. This high-end instrument is versatile and powerful enough to meet your complete bond testing needs. The Royce 650 features a wide range of applications. One-button microscope height adjustment. Large stage travel. With an X-axis travel over 300 mm and a Y-axis travel over 150 mm of the servo driven XY stage, the Royce 650 easily accommodates up to 300 mm wafers and substrates, lead frames and large electronic modules. Interchangeable test modules and tooling. Most test modules and tooling are quickly nterchangeable between the Royce 650 and Royce 620. All test modules have four software selectable subranges down to 1/10 of full scale to maximize the versatility of the instrument. Space saving, easy to access integrated PC. Ultrafine Pitch.
The high-accuracy shear height and sub-micron resolution of the XY stage deliver solid positioning repeatability for ultrafine pitch testing. Unit comes with one load cell model SMW-100G-21845. Ranges: 100g, 50g, 20g, 10g. 120V,50/60Hz, 6A, CE

Now (USD): $19,500.00

Products Similar to: Royce 650

Used Sentro Tech STV-1650C-121216

Inventory Number: 64020
Now (USD): $29,000.00

SENTRO TECH STV-1650C-121216 HIGH TEMPERATURE 1600 C VACUUM FURNACE. Custom high-temperature vacuum furnace and controlled atmosphere furnace. These combined furnaces allow you to alter atmospheric conditions during a single firing cycle. Maximum temperature 1650 degrees C. Bank of 10 MoSi2 Heating elements with a usable chamber area of 10.5"w x 11.5"d x 10.5"h. Alumina silica refractory brick taylored for hightemperature operation. Type B thermocouple for temperature control. Active purge with Argon gas, argon gas mechanical refrigeration system capable of rapid cooling. Pressure control with Festo proportional valve. Includes vacuum pump. Previously used for annealing SiC crystal damage from Ion Implatation. 208V, 1Ph, 60Hz, 90A. Maximum temperature in air 1700°C, Maximum temperature in argon gas 1650°C, Maximum Vacuum at 1500°C 10 -1 torr, Maximum Vacuum at 1400°C 10 -2 torr. Maximum inside chamber positive pressure 8psi. Heating chamber size 12" x 12" x 16".

Product Details

Used Avio PHU-10

Inventory Number: 52634
Now (USD): $950.00

Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

Product Details

Used Leko L930U

Inventory Number: 60373
Now (USD): $4,950.00

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

Product Details

Used Ohashi CAJR-02SDPX

Inventory Number: 60383
Now (USD): $12,000.00

Ohashi CAJR-02SDPX Tabletop Chip Alignment System for LCD or FPC. Aligns and mounts IC chips onto a position of LCD or FPC. Date of Mfg.: 9/2010.

Product Details

Used Hypervision Chip Unzip

Inventory Number: 48882
Now (USD): $3,500.00

Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.

Product Details

Used Avio TCW-115A-C

Inventory Number: 52626
Now (USD): $2,950.00

Avio TCW-115A-C TEC Lead Attach Welding System. Avio super welder NA-62D head. Model TCW-115A power supply. Analog power setting. Settings for first heat and second heat time and temperature.

Product Details

Used Benchmark System 2000

Inventory Number: 61894
Now (USD): $500.00

Benchmark System 2000 Seam Sealer Package Welder. As Is, only what is in photo. No power supply or computer.

Product Details

Used West Bond 7372B

Inventory Number: 63079
Now (USD): $10,000.00

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. Currently configured for epoxy die bonding. With pickup tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope. Does not include work holders. FULLY TESTED AND READY TO SHIP.

Product Details

Used West Bond 7372B

Inventory Number: 63226
Now (USD): $11,500.00

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope.

Product Details

Used West Bond 7372B

Inventory Number: 63227
Now (USD): $11,000.00

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope. FULLY TESTED AND READY TO SHIP.

Product Details