Equipment Photos

Equipment Details

Inventory Number: 62087
Category: Bonders - Welders
Manufacturer: K&S

K&S 4523D Tabletop Manual Wedge Bonder. Digital controls. Large 5.3 in. x 5.3 in. bonding area. Consistent tail length with fine adjustment. PLL ultrasonic generator and high-Q transducer. StereoZoom microscope. 200 program storage capacity with six independent channels per program. Digital readout of all bonding parameters. 115V, 50/60 Hz, 4A, CE. Does not come with heated work holder, no work holder with this unit.

Now (USD): $12,500.00

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Used K&S 4523D

Inventory Number: 62906
Now (USD): $13,950.00

K&S 4523D Tabletop Digital Manual Wedge Bonder. 200 program storage capacity with 6 independent channels per program. Digital readout of all bonding parameters. Heated work holder has 2 in. x 2 in. work area. StereoZoom 4 microscope. 115V, 50/60 Hz, 4A, CE.

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Used Avio PHU-10

Inventory Number: 52634
Now (USD): $950.00

Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

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Used Semiconductor Equipment Corp. 410

Inventory Number: 52745
Now (USD): $29,000.00

Semiconductor Equipment Corp. 410 Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

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Used Laurier SA-202

Inventory Number: 53582
Now (USD): $3,950.00

Laurier SA-202 Epoxy Die Bonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.

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Used Laurier SA-202

Inventory Number: 53779
Now (USD): $3,950.00

Laurier SA-202 Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.

Product Details

Used MRSI 505

Inventory Number: 55954
Now (USD): $15,000.00

MRSI 505 Assembly Work Cell. Ultra-precise, high speed, vision guided, flexible, inline. Large work surface accommodates most input and output options. Pick and place. Inspection station with bottom mounted camera, looks like flip chip? Call for additional photos. Sold As Is.

Product Details

Used Laurier CP-222

Inventory Number: 49910
Now (USD): $3,950.00

Laurier CP-222 Chip Placement System for use with Pre-Screened Adhesives. Ideal for LED’s and multiple chip placement on hybrids where epoxies or gold pastes are prescreened on the substrate.

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Used Leko L930U

Inventory Number: 60373
Now (USD): $4,950.00

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

Product Details

Used Ohashi CAJR-02SDPX

Inventory Number: 60383
Now (USD): $12,000.00

Ohashi CAJR-02SDPX Tabletop Chip Alignment System for LCD or FPC. Aligns and mounts IC chips onto a position of LCD or FPC. Date of Mfg.: 9/2010.

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Used Ohashi CBMR-02SDPX

Inventory Number: 60406
Now (USD): $6,500.00

Ohashi CBMR-02SDPX Flat Panel Connector Bonder. Controls for bonding time, bonding temperature, marker on, auto or manual mode, head up/down. Year of Mfg.: 2010.

Product Details