Used K&S 4523

K&S 4523 Manual Wedge Wire Bonder. Offers the versatility to bond simple discrete devices up to complex hybrid, microwave devices. Individual bond parameter and loop height control. Consistent tail length. Can be configured for wire sizes from 0.7 to 3.0 mil. Includes optional heated work holder and spotlight targeting. Includes StereoZoom microscope. 115/220V, 50/60 Hz, 4A, CE. FULLY TESTED READY TO SHIP

K&S 4523D Tabletop Digital Manual Wedge Bonder. 200 program storage capacity with 6 independent channels per program. Digital readout of all bonding parameters. Heated work holder has 2 in. x 2 in. work area. StereoZoom 4 microscope. 115V, 50/60 Hz, 4A, CE. FULLY TESTED READY TO SHIP.

Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

Laurier SA-202 Epoxy Die Bonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.

Laurier SA-202 Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.

Laurier CP-222 Chip Placement System for use with Pre-Screened Adhesives. Ideal for LED’s and multiple chip placement on hybrids where epoxies or gold pastes are prescreened on the substrate.

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

Ohashi CAJR-02SDPX Tabletop Chip Alignment System for LCD or FPC. Aligns and mounts IC chips onto a position of LCD or FPC. Date of Mfg.: 9/2010.

Ohashi CBMR-02SDPX Flat Panel Connector Bonder. Controls for bonding time, bonding temperature, marker on, auto or manual mode, head up/down. Year of Mfg.: 2010.

Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.