Equipment Photos

Equipment Details

Inventory Number: 63998
Category: Bonders - Welders
Manufacturer: K&S

K&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or added manufacturing support. Provides the high yield and excellent repeatability needed. Consistent ball size via negative electronic flame-off. Missing ball detection and auto-stop. Consistent tail length with fine adjustment on operator panel. Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer. Stereo microscope and spotlight targeting options. 115V, 50/60 Hz, 4.0A, CE

Now (USD): $12,950.00

Products Similar to: K&S 4522

Used K&S 4522

Inventory Number: 63997
Now (USD): $12,950.00

K&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or added manufacturing support. Provides the high yield and excellent repeatability needed. Consistent ball size via negative electronic flame-off. Missing ball detection and auto-stop. Consistent tail length with fine adjustment on operator panel. Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer. Stereo microscope and spotlight targeting options. 115V, 50/60 Hz, 4.0A, CE

Product Details

Used K&S 4522

Inventory Number: 63999
Now (USD): $12,950.00

K&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or added manufacturing support. Provides the high yield and excellent repeatability needed. Consistent ball size via negative electronic flame-off. Missing ball detection and auto-stop. Consistent tail length with fine adjustment on operator panel. Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer. Stereo microscope and spotlight targeting options. 115V, 50/60 Hz, 4.0A, CE

Product Details

Used Avio PHU-10

Inventory Number: 52634
Now (USD): $950.00

Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

Product Details

Used Laurier SA-202

Inventory Number: 53582
Now (USD): $3,950.00

Laurier SA-202 Epoxy Die Bonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.

Product Details

Used Laurier SA-202

Inventory Number: 53779
Now (USD): $3,950.00

Laurier SA-202 Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.

Product Details

Used Laurier CP-222

Inventory Number: 49910
Now (USD): $3,950.00

Laurier CP-222 Chip Placement System for use with Pre-Screened Adhesives. Ideal for LED’s and multiple chip placement on hybrids where epoxies or gold pastes are prescreened on the substrate.

Product Details

Used Leko L930U

Inventory Number: 60373
Now (USD): $4,950.00

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

Product Details

Used Ohashi CAJR-02SDPX

Inventory Number: 60383
Now (USD): $12,000.00

Ohashi CAJR-02SDPX Tabletop Chip Alignment System for LCD or FPC. Aligns and mounts IC chips onto a position of LCD or FPC. Date of Mfg.: 9/2010.

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Used Ohashi CBMR-02SDPX

Inventory Number: 60406
Now (USD): $6,500.00

Ohashi CBMR-02SDPX Flat Panel Connector Bonder. Controls for bonding time, bonding temperature, marker on, auto or manual mode, head up/down. Year of Mfg.: 2010.

Product Details

Used Hypervision Chip Unzip

Inventory Number: 48882
Now (USD): $3,500.00

Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.

Product Details