Used Micromanipulator 450

Tridak 450 Precision Fluid Dispensing Controller. Controller only no valves. Used in production assembly lines and as automatic product filing equipment. 115V, 60 Hz.

Wavelength Electronics LFI-4505 Laser Diode Driver. 500mA laser diode driver. Low noise, stable current source. Constant current and constant power control modes. 115V, 230V, 50/60 Hz, CE.

Ultrasonic Systems P450-1-151 Selective Coating System. Programmable selective coating system for precise application of a wide range of materials for the semiconductor, electronics, medical and industrial markets. Features Ultra-Spray technology which enables more accurate, thinner coating applications than conventional spray and dispensing technology. Currently configured with CAT ILDS head. Conveyor system. Graphical user interface. 115V, 50/60 Hz, 13A, CE.

Alessi REL-4500 150mm Manual Analytical Prober. Vacuum Chuck: 6 in. dia. (150mm). Manual XY stage movement: 6 in. X x 6 in. Y. Platen accepts vacuum or magnetic base probe manipulators. Bausch and Lomb microscope with Bausch and Lomb objectives Industrial 2.25X and Industrial 8X. Manual quick lift platen.

Wentworth 034-4002 Probe Contact Box.

Integrated Technology Corp. PB500A Probe Card Repair and Analysis Station. Computer controlled system fully tests and exercise the probe card and allows complete statistical monitoring of probe card performance. Planarization, current leakage and resistance testing. Full database kept on each probe card for statistical process control.

Cascade Microtech FPD-100 Vacuum Based Dual Probe Holder. These tools are for mounting two of the Cascade DCM 200 manipulators together on vacuum base for easy mounting and removal. $250 each.

Signatone CM400 Automated Analytical Probe Station. Not complete, sold as is for parts.

MPI LEDA-8F 3G Plus-V 110 3G Wafer Prober. Plus-V is a wafer prober for testing diced die on stretch frame (dies on blue tape mounted on a tape ring). Wafers cut, broken by scribing, laser etc. and then expanded on stretch frame. May be tested to determine if any secondary operations have damaged the product. The maximum test area for the system is 6 inches of active die area or smaller. Machine Features: 3G Plus-V provides the functions of die position information saving, auto-probing, testing etc. It contains these advantages: * Automatic diced wafer alignment. * Rapid pre-scan provides fast die position information speeding test and increasing throughput. Probe station for testing LED light emitting diodes. Compact rigid and reliable semiautomatic chip probing system. PC controller. 5 in. dia. vacuum chuck. Four precision probe manipulators. StereoZoom microscope. WEI Industries Co. Ltd model LED-632HC LED tester. This controller tested for power only, not LED testing. 110V, 50/60 Hz.

Wentworth 0-001-1096 Vacuum Base Probe Manipulator. Micrometer on X-Y axis.