Used K&S 4124

Pulse Heating Power Supply with NT-5A Transformer.

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

Epoxy Die Bonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.

Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.

Chip Placement System for use with Pre-Screened Adhesives. Simple vacuum pick up tool for die pick and place. StereoZoom microscope.

Assembly Work Cell. Ultra-precise, high speed, vision guided, flexible, inline. Large work surface accommodates most input and output options. Pick and place. Inspection station with bottom mounted camera, looks like flip chip? Call for additional photos.

Ultrasonic Heavy Wire Wedge Bonder. Configured for ribbon wire. Semiautomatic operation, automatic adjustable looping and stepback produce uniform loop heights for more consistent, higher quality bonds. Wire Size: Capable of 4 to 20 mil with appropriate wedge tool. 115V, 50/60 Hz.

Automated Gold Ball Bonder. Flying bondhead operates by means of a frictionless air bearing. System has programmable focus option. E-Stop and Venturi vacuum. 2 in. x 2-1/2 in. work table travel. Programmable X-Y-Z indexer. Currently 80 micron machine but upgradable to 65 micron. Installation and custom configurations available at added cost.

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Granite table with granite risers. Alignment accuracy is +/-5 microns. PC controller.

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size:
0.010 in. sq. to 1.000 in. sq.