Used CEE Brewer Science 100GX

Integrated Solutions OPTITRAC 6" Photoresist Developer Track. Developer track is currently configured for 6" wafers. System configured with two elevators, 2 standard bake stations, 2 vented bake stations and one developer spinner station. System came out of a running facility. We are selling this as is with a 30 day right to return.

Headway Research PWM32-R790 Photoresist Spinner. Up to 10,000 rpm, for relatively light loads such as silicon wafers, small photomasks, etc. R790 Bowl: 7.9-inch I.D., reduced by a removable splash deflector to a maximum recommended substrate dimension of 5 inches. 115V, 50/60Hz

The Cee 1100FX Hot Plate is a programmable hotplate for baking resists coated on samples.  There are 10 user programs available which contain preset values for bake Ramp/Soak temperatures, bake time and bake method.  The bake method options are proximity, soft contact and hard contact.  Hard contact promotes best uniformity and minimizes bowing and warping of substrate.  Proximity bake provides slower heating of substrate which helps reduce blistering and cracking of films with fast drying solvents.  A recommended method is to use proximity bake as prebake and followed up by hard contact bake.  Each program allows up to three consecutive bake methods for maximum control of substrate warm up, solvent drying and resin curing characteristics. 

Specifications:
Bake temperature: 300 degrees C maximum
Bake temparature resolution:  1 degree C.
Substrate size: 150 to 300mm

240V, 1Ph,60Hz

The Cee 1100FX Hot Plate is a programmable hotplate for baking resists coated on samples.  There are 10 user programs available which contain preset values for bake Ramp/Soak temperatures, bake time and bake method.  The bake method options are proximity, soft contact and hard contact.  Hard contact promotes best uniformity and minimizes bowing and warping of substrate.  Proximity bake provides slower heating of substrate which helps reduce blistering and cracking of films with fast drying solvents.  A recommended method is to use proximity bake as prebake and followed up by hard contact bake.  Each program allows up to three consecutive bake methods for maximum control of substrate warm up, solvent drying and resin curing characteristics. 

Specifications:
Bake temperature: 300 degrees C maximum
Bake temparature resolution:  1 degree C.
Substrate size: 150 to 300mm

240V, 1Ph,60Hz