New Arrivals

UVOCS T16X16/OES Ultraviolet Ozone Cleaning System. Cleaning or oxidation with the UVOCS is accomplished by the combination of ultraviolet light and ozone.  Low pressure quartz-mercury vapor lamp which generates UV emissions in the 254 and 185 nanometer range.  Source Size: 16” x 16”. Active Area: 256 sq. in. Width: 20”. Depth: 29¾”. Height: 14½ ”. 110 V, 60 Hz, 5.0A

UHV Surface Science Vacuum Chamber. Chamber size 11.75" Diameter. Bottom flange is 8" OD conflat. Side flange is 10"OD conflat. One 8" OD conflat on side. Two 6" OD conflat flanges. Four 4.5" OD conflats. Nine 2.75"OD conflats.

Varian V-70 Turbo with Controller. Conflat flange 4.5"OD and 2.75" ID. Controller does not have a front panel display, remote operations only. 120V, 50/60Hz

View Pinnacle 250 Video Measuring Tool. The Pinnacle features a damped granite base and column, with passive vibration isolation. A precision compound X-Y stage with high-speed linear motor drives provides velocity of 400 mm / sec and acceleration of 1000 mm / sec2. This combination of high acceleration and high velocity enables the high throughput required for near-line process monitoring. The rugged and compact design of the Pinnacle lends itself to installation in either a Q/A lab or at an inspection station in the manufacturing line.

The Pinnacle is ideal for measurement of small, close tolerance parts, particularly parts with a high density of features, such as hard disk drive suspensions, printer heads, precision stampings, leadframes, ball-grid arrays, and chip scale packages.

VWR 1177PD Refrigerated Recirculating Chiller. Temperature Range -10°C to +40°C. Digital setpoint controller. Cooling capacity 2300W @ 20°C, 1550W @ 10°C, 875W @ 0°C. Positive displacement pump capacity 13.2 L/min. (3.5 GPM) 230V, 60Hz, 11.9A

West Bond 7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wire Bonder Bonds gold wires ranging from 0.0007” to 0.002”. Three-axis manual micromanipulator, entire mechanism arrayed above the work plane, so there is no limit to size of work piece. All machine configuration constants and bond settings are programmable, prompted by a series of screens. Heated work holder with digital control. 115V, 50/60 Hz, 10A

WEST BOND 747677E-79C Combination Bonder capable of Ball Bonding and Wedge Bonding. Bonder comes with two bond heads, one wedge and one ball bond. Easy and quick change over. Three-axis micromanipulator with entire mechanism above the work plane, no limit to the size of a work piece. Heated stage with digital  controller. Machine configuration constants and bond settings are programmable. 110V, 50/60Hz, 2A

YIELD YES 310 Dual Function Image Reversal or HMDS Vapor Prime Oven. Capacity for HMDS Prime: 8 cassettes of 4” wafers, or 1 cassette of 5-8” wafers. Capacity for Image Reversal: 4 cassettes of 4” wafers, or 1 cassette of 5-8” wafers. Cleanliness: <10x1 micron particles per 4” wafer. Throughput for HMDS Prime: 2 full loads/hr. Throughput for Image Reversal: (2) ½ loads/hr. Temperature: 250°C maximum. Does not include a vacuum pump at this price.