Bid Service, LLC 225 Willow Brook Rd. Freehold, NJ 07728
Phone: 732-863-9500 Fax: 732-863-1255
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You searched for: "epoxy".
Epobonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.
Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.
Fluid Dispensing System for SMT Applications. System utilizes ball screw and servo motors on all three axes to assure smooth, precise and accurate dispensing with an easy to use enhanced graphic user interface. Speedline 1230 automatic load and unload stations. Large 14 in. x 14 in. dispense area. Dual dispense heads. Camera. Adjustable conveyor width. Dispense up to 25,000 dots of solder paste or SMD epoxy per hour.
Ultraprint 3000™ Stencil Printer. Fully automated system incorporates sophisticated controls to accurately apply solder paste, epoxy, flux and inks on all types of substrates.
Mechanical Convection Horizontal Airflow Oven. Ideal for ASTM testing, epoxy curing, moisture drying, UL testing, aging of devices and other testing requirements. Watlow EZ-Zone digital setpoint controller. Overtemp controller. Max. Temp.: 350 deg C. Inside Dimensions: 20 in. L x 18 in. W x 20 in. H. 240V, 1 Ph, 60 Hz, 20A.
Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.
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