Search Results

You searched for: "epoxy".

Matching Products

Used Laurier SA-202

Inventory Number: 53582
Now (USD): $3,950.00

Epobonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.

Product Details

Used Laurier SA-202

Inventory Number: 53779
Now (USD): $3,950.00

Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.

Product Details

Used F&K Delvotec FMI 555E

Inventory Number: 58342
Now (USD): $5,950.00

Table Top Manual Epoxy Die Bonder. Tool rotates to change tool from pick-up to epoxy dispense. 115V, 50/60 Hz, CE.

Product Details

Used MRSI MRSI 170

Inventory Number: 49567
Now (USD): $15,000.00

Automated High Precision Epoxy Dispenser. System automatically aligns the substrate pattern, profiles the substrate heights, cleans the dispensing tip and purges the needle before starting to dispense. Capable of dispensing dots as well as continuous lines and areas.

Product Details

Used Camelot Systems CAMALOT 3800

Inventory Number: 55952
Now (USD): $49,000.00

Fluid Dispensing System for SMT Applications. System utilizes ball screw and servo motors on all three axes to assure smooth, precise and accurate dispensing with an easy to use enhanced graphic user interface. Speedline 1230 automatic load and unload stations. Large 14 in. x 14 in. dispense area. Dual dispense heads. Camera. Adjustable conveyor width. Dispense up to 25,000 dots of solder paste or SMD epoxy per hour.

Product Details

Used Hypervision CHIP UNZIP

Inventory Number: 48882
Now (USD): $6,500.00

Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.

Product Details

Used Wentworth 0-02-0200

Inventory Number: 50148
Now (USD): $7,500.00

Probe Card Repair and Test Station. High precision tool for maintenance, repair and testing of epoxy probe cards. Enables operator to check and adjust probe alignment, planarize, invert the card to change probes, exercise the card to duplicate production testing conditions, clean the probe tips and accurately check resistance of every probe. 115V, 60 Hz, 3A.

Product Details

Used Speedline/MPM UP3000/A

Inventory Number: 52696
Now (USD): $25,000.00

Ultraprint 3000™ Stencil Printer. Fully automated system incorporates sophisticated controls to accurately apply solder paste, epoxy, flux and inks on all types of substrates.

Product Details

Matching Pages

0 Results in 0.187 seconds.