Bid Service, LLC 225 Willow Brook Rd. Freehold, NJ 07728
Phone: 732-863-9500 Fax: 732-863-1255
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Epobonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.
Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.
Table Top Manual Epoxy Die Bonder. Tool rotates to change tool from pick-up to epoxy dispense. 115V, 50/60 Hz, CE.
Automated High Precision Epoxy Dispenser. System automatically aligns the substrate pattern, profiles the substrate heights, cleans the dispensing tip and purges the needle before starting to dispense. Capable of dispensing dots as well as continuous lines and areas.
Fluid Dispensing System for SMT Applications. System utilizes ball screw and servo motors on all three axes to assure smooth, precise and accurate dispensing with an easy to use enhanced graphic user interface. Speedline 1230 automatic load and unload stations. Large 14 in. x 14 in. dispense area. Dual dispense heads. Camera. Adjustable conveyor width. Dispense up to 25,000 dots of solder paste or SMD epoxy per hour.
Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.
Probe Card Repair and Test Station. High precision tool for maintenance, repair and testing of epoxy probe cards. Enables operator to check and adjust probe alignment, planarize, invert the card to change probes, exercise the card to duplicate production testing conditions, clean the probe tips and accurately check resistance of every probe. 115V, 60 Hz, 3A.
Ultraprint 3000™ Stencil Printer. Fully automated system incorporates sophisticated controls to accurately apply solder paste, epoxy, flux and inks on all types of substrates.
Manual Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Epoxy dot size adjustable from 0.005 in. to 0.250 in. Operator first picks up a die from the die dish with the vacuum operated pick-up arm. Simultaneously a precise dot of epoxy is dispensed onto the substrate in the proper location. Next the unit’s work station is easily slid into position under the die pick-up arm. The die is then inserted into the epoxy by the operator using the StereoZoom microscope. Micrometer adjustments of X and Y axes as well as dispenser height.
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