Equipment Photos

Equipment Details

Inventory Number: 52745
Category: Bonders - Welders
Manufacturer: Semiconductor Equipment Corp.

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

Now (USD): $29,000.00

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Product Details

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Product Details

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Product Details

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Product Details