Bid Service, LLC 225 Willow Brook Rd. Freehold, NJ 07728
Phone: 732-863-9500Email: [email protected]
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Seiko Instruments OFL-11 Triple Platen Fiber Optic Polisher. 3 station optical fiber polisher. 100V, 50/60 Hz.
Logitech DH-300 Driven Head Precision Polishing System. Developed to address the issue of polishing times when processing semiconductor materials often describe as “hard” to polish within the industry. These systems have been designed for semi-automated final stage polishing of hard materials such as sapphire, silicon carbide (SiC)or gallium nitride (GaN). Features special polishing carrier head that applies high levels of down-force onto the samples, whilst rotational speed and direction are fully controllable. This results in the highest level of sample throughput of any of the Logitech systems.
Spex 6850 Cryogenic Impact Mill. Uses steel impactor driven by magnetic coils. Requires liquid nitrogen as coolant. Coil will hold one 6801 vial or our 6751 vials. Digital controls. Liquid nitrogen consumption is typically 15 to 20 liters for initial cool down and filling of tub, 4 to 6 liters for each hour of operation there after. 115V, 1 Ph, 60 Hz, 15A
Senko APC 8000 Fiber Optic Polishing System. The APC-8000 features a superior fixture-to-platten locking mechanism and other design enhancements giving the user consistent polishing results at high production volumes. The fixture-to-platten locking mechanism confines motion to vertical plane, eliminating horizontal movement in the fixture that may cause damage to the fiber. 110V, 50/60Hz, 4A
Retsch ZM200 Centrifugal Mill. For rapid size reduction of soft to medium-hard and fibrous materials.
Effective pulverization technique ensures quick, gentle preparation of analytical samples with higher throughput. Wide range of accessories makes this a versatile grinding device. Unique drive system produces higher throughput than other rotor mills.
RETSCH Safety Jar Clamp for grinding jars 250 ml. 2 Available
Buehler Vanguard® 2000 Fully Automatic Grinding-Polishing System. Fully automated means that samples can be prepared from start to finish without continuous operator involvement. Just load up to six samples at a time, select the preparation method, and step away. In as little as 15 to 20 minutes your samples will be finished; cleaned, dried, and ready for analysis. The Buehler Vanguard 2000’s microprocessor based system allows the user to select from six preinstalled methods or up to 44 individually created preparation methods. After the method is started, the robotic arm automatically loads one of six selected platens onto the grinding-polishing base. Next, the automatic head places the samples on the platen while providing single or central load application. A fully integrated dispensing system automatically doses abrasive suspensions onto the grinding/polishing surface.