Equipment Photos

Equipment Details

Inventory Number: 53779
Category: Bonders - Welders
Manufacturer: Laurier
Epoxy Die Bonder. Provides fast, highly accurate chip placement and bonding. Counter balanced and adjustable die pick-up arm. Bausch & Lomb StereoZoom microscope.
Now (USD): $3,950.00

Products Similar to: Laurier SA-202

Used Laurier SA-202

Inventory Number: 53582
Now (USD): $3,950.00

Epoxy Die Bonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.

Product Details

Used Avio PHU-10

Inventory Number: 52634
Now (USD): $950.00

Pulse Heating Power Supply with NT-5A Transformer.

Product Details

Used Semiconductor Equipment Corp. 410

Inventory Number: 52745
Now (USD): $29,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

Product Details

Used Laurier SA-202

Inventory Number: 53582
Now (USD): $3,950.00

Epoxy Die Bonder with Rotary Collet Die Pick Up option. A production work station for mounting single or multiple dice on a diversity of substrates and packages. Performs the functions of die pick-up, epoxy dispensing and die location.

Product Details

Used Laurier CP-222-S

Inventory Number: 54495
Now (USD): $1,950.00

Chip Placement System for use with Pre-Screened Adhesives. Simple vacuum pick up tool for die pick and place. StereoZoom microscope.

Product Details

Used MRSI 505

Inventory Number: 55954
Now (USD): $59,000.00

Assembly Work Cell. Ultra-precise, high speed, vision guided, flexible, inline. Large work surface accommodates most input and output options. Pick and place. Inspection station with bottom mounted camera, looks like flip chip? Call for additional photos.

Product Details

Used Orthodyne 20

Inventory Number: 57598
Now (USD): $6,500.00

Ultrasonic Heavy Wire Wedge Bonder. Configured for ribbon wire. Semiautomatic operation, automatic adjustable looping and stepback produce uniform loop heights for more consistent, higher quality bonds. Wire Size: Capable of 4 to 20 mil with appropriate wedge tool. 115V, 50/60 Hz.

Product Details

Used ESEC 3018 AWB

Inventory Number: 46614
Now (USD): $15,000.00

Automated Gold Ball Bonder. Flying bondhead operates by means of a frictionless air bearing. System has programmable focus option. E-Stop and Venturi vacuum. 2 in. x 2-1/2 in. work table travel. Programmable X-Y-Z indexer. Currently 80 micron machine but upgradable to 65 micron. Installation and custom configurations available at added cost.

Product Details

Used Semiconductor Equipment Corp. 410X

Inventory Number: 52615
Now (USD): $25,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Granite table with granite risers. Alignment accuracy is +/-5 microns. PC controller.

Product Details

Used Semiconductor Equipment Corp. 410

Inventory Number: 57636
Now (USD): $29,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size:
0.010 in. sq. to 1.000 in. sq.

Product Details