Bid Service, LLC 225 Willow Brook Rd. Freehold, NJ 07728
Phone: 732-863-9500 Fax: 732-863-1255
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984 Dicing Saw 4 inch Spindle. Rebuilt.
Slicing Machine. Controller: GE Fanuc Series O-M. MFG. 1989. For automatic slicing of ceramic materials, ferrite, quartz, optical glass. Slicing blade dia. 100-150 mm. 1 fixed spindle speed range from 2500-8000 RPM. Longitudinal Path: 300 mm. Cross path: 140 mm. Vertical path: 100 mm. Resolution in all 3 axes: 0.001 mm. Feed speeds programmable from 5-2000 mm/min. Workable: 300 x 150 mm. Distance spindle axis workable:50-150 mm. Missing PLC program, computer and program will have to be replaced. Sold As Is, untested.
Automated Dicing Saw. Max. Substrate Size: 150 mm. Range of Indexing: 0.0001 to 99.9999 mm. Minimum Step Indexing: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm. Older dicing saw but in good condition.
Hard Material Dicing Saw. Diamond wheel cuts material on a 6 in. dia. vacuum chuck. Digital readout of X and Y axis. Manual control of index. Motorized cut feed. 200/220V, 3 Ph, 60 Hz.
150mm Fully Programmable Scriber Breaker. Designed to increase yield and provide superior processing speeds. Windows operating environment provides a fast user friendly interface. Zero kerf loss allows higher die density on wafer. Fully programmable for all scribing and breaking parameters including TrueAngle diamond tool positioning. Currently configured for 6 in. dia. tape rings and up to 4 in. dia. wafers. Can be retooled to do up to 150mm wafers. 100-240V,1 Ph,50/60 Hz,10/5A,CE.
Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.
Precision Wafer Scriber. The scribe cycling system and low inertia tool holder allow scribing without tool bounce at rates approaching 40 strokes per minute. Scribes silicon, III-V compounds, ceramic, quartz, glass, 6mm to 80mm wafers or substrates. 50 to 1000 microns thickness. Older unit but sold in good working condition.
Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.
THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR LOOMIS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Precision Scriber Breaker. Roller style breaker. Motorized X-Axis control, 0.5 micron positioning resolution. Motorized rotation control. 4 in. wafer capability. Windows® operating system. Color camera. 100/240V, 1 Ph, 50/60 Hz.
Precision Automatic Wafer Dicing Saw. Extra-high precision automatic cutting saw for cutting materials such as silicon wafers, glass and small electronic parts made of ceramic. Work Piece Size: 152mm. Theta Axis Rotation: 380 degrees. Dual objective split image microscope. 1.5 kW Synchro Spindle™. Requires house air and water. 200V, 3 Ph, 50/60 Hz.
Dicing System. Unparalleled machine rigidity, a unique overarm spindle support. Three layers of vibration isolation, Windows™ based CNC controls. For dicing silicon, gallium arsenide, glass, ceramics and other brittle materials. 2 in. air bearing spindle up to 40,000 rpm. 6 in. dia. vacuum chuck. 208V, 3 Ph, 50/60 Hz.
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