High Pressure Microwash Substrate Cleaning System. For sawed/scribed wafers or photomask cleaning. Utilizes an oscillating high pressure deionized water jet spray of up to 2000 psi with 0.2 micron filtration. Handles wafers up to 8 in. dia. depending on type of chuck installed. Touch screen operation. CO2 reionizer for elimination of static charge. Nitrogen dry. Infrared heat lamp. 115V, 50/60 Hz, 6A.