Equipment Photos

Equipment Details

Inventory Number: 48882
Category: Bonders - Welders
Manufacturer: Hypervision

Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.

Now (USD): $3,500.00

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Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

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Inventory Number: 60373
Now (USD): $4,950.00

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

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Inventory Number: 60383
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Product Details

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Inventory Number: 61894
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Inventory Number: 63226
Now (USD): $11,500.00

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Product Details

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Inventory Number: 64238
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Inventory Number: 64299
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XYZTec Condor Sigma Advanced Bond Tester. Sigma is the most advanced bond tester. It comes with game-changing automation capabilities and high specifications in: Sensor accuracy, large x stages, superior axis speed and future proof and modular design. The Revolving Measurement Unit (RMU) houses up to 6 flexible sensors that are configurable with various pull, peel, push, or shear tools. This enables continuous testing up to 200 kgf. Software comes with 2 levels of programming to make it approachable for operators and engineers to customize the widest range of manual and automated test sequences. Onboard graphics and intelligent wizards allow easy programming with limited automation commands for one default test method. The software ensures complete documentation of the test protocol, provides preset configurations, and intuitive operator screens. Operators can start automations, created and maintained on engineering level, with a single click. Statistical Process Control (SPC) offers comprehensive statistical information to analyze your production process. This includes different types of graphs to view on screen or to print as reports. 110v,50/60hZ,CE

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Inventory Number: 64719
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