K&S

K&S 961 Wafer Tape Frame Mounter. The K&S Model 961 Wafer Mounting Station enables the mounting of wafers up to 6 inches in diameter. This mounting station is compatible with standard or interleaved UV-curable tape, and contains a vacuum stage wafer hold-down for holding the wafer in position during mounting. A programmable heating stage heats the tape to attain uniform tensioning, the adjustable spring loaded plate ensures optimal contact pressure and a built-in tape cutter facilitates mounted piece extraction. Includes optional static eliminator and tape backing removal assembly. 110V, 50/60Hz, 5A. HERE IS A LINK TO A VIDEO DEMONSTRATION OF THIS TOOL WORKING 

https://youtu.be/AST4UKs81MY

K&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or added manufacturing support. Provides the high yield and excellent repeatability needed. Consistent ball size via negative electronic flame-off. Missing ball detection and auto-stop. Consistent tail length with fine adjustment on operator panel. Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer.115V, 50/60Hz, 4A

K&S 4524AD Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Motorized Y axis and programmable auto-stepback function for precise wire length and loop formation. Digital readout of all bonding parameters. Auto-second bond mode. Fiber optic illuminator and spotlight targeting option. Heated work holder and controller included. StereoZoom microscope. 115V, 50/60 Hz, 4A, CE.