Used K&S 973

Inventory Number: 54710
Now (USD): $9,500.00

High Pressure Microwash Substrate Cleaning System. For sawed/scribed wafers or photomask cleaning. Utilizes an oscillating high pressure deionized water jet spray of up to 2000 psi with 0.2 micron filtration. Handles wafers up to 8 in. dia. depending on type of chuck installed. Touch screen operation. CO2 reionizer for elimination of static charge. Nitrogen dry. Infrared heat lamp. 115V, 50/60 Hz, 6A.

Product Details

Used K&S 973

Inventory Number: 54734
Now (USD): $9,500.00

High Pressure Microwash Substrate Cleaning System. For sawed/scribed wafers or photomask cleaning. Utilizes an oscillating high pressure deionized water jet spray of up to 2000 psi with 0.2 micron filtration. Handles wafers up to 8 in. dia. depending on type of chuck installed. Touch screen operation. CO2 reionizer for elimination of static charge. Nitrogen dry. Infrared heat lamp. 115V, 50/60 Hz, 6A.

Product Details

Used K&S 984-6

Inventory Number: 56722
Now (USD): $21,500.00

Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.

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Used K&S Spindle

Inventory Number: 57218
Now (USD): $2,500.00

984 Dicing Saw 4 inch Spindle. Rebuilt.

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Used K&S 7100 AD

Inventory Number: 56732
Now (USD): $25,000.00

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

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Used K&S MWB Maintenance Tool Kit

Inventory Number: 60178
Now (USD): $300.00

4500 Series Wire Bonder maintenance kit.

Product Details

Used K&S 4124

Inventory Number: 54581
Now (USD): $6,500.00

Manual Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.

Product Details

Used K&S 7100 ADHM

Inventory Number: 60629
Now (USD): $29,000.00

Precision Dicing Saw Suitable for Hard Materials. Windows based operating system. 4 in. spindle programmable to 30,000 rpm. Blade Size: 4 in. to 5 in. 6 in. dia. porous vacuum chuck. Indexing Axis Resolution: 0.2 micrometers. 200-240V, 1 Ph, 50/60 Hz, 15A.

Product Details

Used K&S 7100 AD

Inventory Number: 60659
Now (USD): $25,000.00

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

Product Details

Used K&S 7100 AD

Inventory Number: 60665
Now (USD): $25,000.00

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

Product Details