Hybond

Hybond 626 Multipurpose Digital Thermosonic Wire Bonder, Ball Bonder, Wedge Bonder, Bump or Stud Bonder, Peg Bonder and more. Model 626 is a Deep Access, Long Reach Wire Bonder that can operate as a Ball, Wedge, Bump or Peg bonder. It can be used for wire diameters from 0.7 to 3.0 mil (18 to 76μm) gold wire when in Ball/Bump bonder configuration, or wire diameters from 0.5 to 3.0 mil (12,7 to 76μm) and ribbon up to 1.0 x 20.0 mil (25,4 x 510μm) for Wedge or Peg bonding configuration. The 626 was specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FET's, MMICs and LED's. Model 626's motorized wire feed and wire/ribbon clamping system provide superior wire/ribbon control and allow the operator to increase or decrease tail length in 1 mil (25μm) increments at a touch of a switch. The 626 shows actual units for set up of bond parameters. The change over from Ball bonder to Wedge bonder requires only a press of a button to turn EFO power to zero and a change from capillary to wedge tool. 110V, 50/60Hz.