Refurbished with a 30 Day Right of
Return and 3-Month Warranty! (Unless sold "AS-IS" * )
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ASECO
S-200 -- $19,500
Used
ASECO
S-200
Pick and Place Tri-Temp Test Handler.
Designed to accommodate IC packages in trays.
Permits quick changeover of conversion kits for a variety of advanced component types including QFP, BGA, PGA, TSSOP and PLCC packages.
11 x 11 CPBA package accommodation kit.
JEDEC universal tray adaption kit (Type III).
Temperature chamber screen assembly.
Ultra ENT2, M2300, 512MB, 4.2GB.
Mfg.:1997. Excellent Condition.
Inventory#:
39571
Used
AUTOMATED PRODUCTION SYSTEMS
MPP-21
Manual Pick and Place.
Uses pick up needle to manipulate die manually.
Can be configured to dispense, no dispense parts currently on system. 120V, 60 Hz.
Inventory#:
55334
Used
AVIO
TCW-115A-C
TEC Lead Attach System.
Avio super welder NA-62D head.
Model TCW-115A power supply.
Analog power setting.
Settings for 1st heat and 2nd heat time and temperature.
Inventory#:
52626
Used
DAGE
2400
Wire Pull Tester.
Smart electronics identifies load cartridge.
Non PC version.
Controller with built in printer.
WP1kg load cell.
110/220V, 1 Ph, 50/60 Hz.
Inventory#:
51191
Used
DAGE
4000 PAXY
Series 4000 Bond Tester.
Modular multifunction bond and shear tester. Currently with a WP1KG wire pull load cell and a TP1KG tweezer pull load cell. Intuitive operating screens enable quick test set up and editing of test parameters. On-board statistical results. Motorized stage allows semiautomatic testing. 110/230V, 1 Ph, 50/60 Hz, CE.
Inventory#:
55024
Used
DAGE
BT 25
Automatic Wirebond Tester.
Offers the benefit of full microprocessor control, to ensure 100 percent testing of up to 15,000 discrete points per substrate. Easily programmed using alphanumeric keyboard and liquid-crystal display, the Series 25 meets the requirements of MIL-STD-883 with a speed of (less than 2 sec. per wire), precision (+/- 5 micro-meters), and consistency +/- 10 micro-meters).
Inventory#:
27304
Used
DAGE
MF-22A
Wire Pull Tester.
Designed for destructive or non-destructive bond strength testing.
Microprocessor controller with alphanumeric display.
Built in printer.
Sterozoom Microscope.
Inventory#:
49227
Used
EPE TECHNOLOGY
20/20
Pick and Place.
Completely self contained, programmable, computer controlled,
four axis, single head pick and place printed circuit board assembly system.
All surface mount components with a flat top
surface of at least .040 in. square can be accommodated.
Small pitch gull wing devices, 100 pin or 132 pin .8mm, .65mm,
or .25 in. are especially a forte of the 20/20.
Sold As Is $2,950. Working with 30 day right of return $9,500.
Inventory#:
29473
Used
ESEC
3018 AWB
Automated Gold Ball Bonder.
Flying bondhead operates by means of a frictionless air bearing.
System has programmable focus option.
E-Stop and Venturi vacuum.
2 in. x 2-1/2 in. work table travel.
Programmable X-Y-Z indexer. Currently 80 micron machine but upgradable to 65 micron.
Installation and custom configurations available at added cost.
Inventory#:
46614
Used
HUGHES
WD-16500-003
Programmable Reflow Solder Power Supply.
LCD display of solder schedule time and temperature settings.
Offers step by step programming instructions.
115V, 50/60 Hz, 8A.
Inventory#:
52012
Used
K&S
1488 Plus
Automatic Gold Ball Bonder.
Computer controlled system Graphic displays and interactive display.
CALL FOR DETAILS. Sold As Is. NO MICROSCOPE.
Inventory#:
38257
Used
K&S
4123
Manual Wedge Bonder.
Raised work area, no heated work holder.
Aluminum or gold wire wedge bonder.
Wire Diameter: 0.5 to 3.0 mil for gold. 1.0 to 3.0 for aluminum.
115V, 60 Hz.
Inventory#:
49271
Used
K&S
4123
Universal Wedge Bonder.
An aluminum or gold wire bonder versatile enough to bond simple ICs
and discrete devices or complex hybrids with height variations up to 200 mils.
With spotlight target option.
Wire Diameter Range: Gold 0.5 to 3.0 mil., Aluminum 1.0 to 3.0 mil. 120V, 60 Hz.
No Work Holder.
Inventory#:
44064
Used
K&S
4123
Universal Wedge Bonder.
An aluminum or gold wire bonder versatile enough to bond simple ICs
and discrete devices or complex hybrids with height variations up to 200 mils.
Wire Diameter Range: Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60Hz.
NO WORK HOLDER.
Inventory#:
52620
Used
K&S
4123
Universal Manual Wedge Bonder with Heated Work Holder.
Aluminum or gold wire wedge bonder.
Wire Diameter Range: Gold 0.5 to 3.0 mil., Aluminum 1.0 to 3.0 mil.
Front panel electronic setting of bonding parameters.
Inventory#:
53657
Used
K&S
4123
Universal Wedge Bonder.
An aluminum or gold wire bonder versatile enough to bond simple
ICs and discrete devices or complex hybrids with height variations up to 200 mils.
Wire Diameter Range
Gold: 0.5 to 3.0 mil.
Aluminum: 1.0 to 3.0 mil.
120V, 60 Hz.
NO WORK HOLDER
Inventory#:
54076
Used
K&S
4124
Gold Ball Bonder with Heated Work Stage.
Versatile enough to bond simple ICs and discrete devices or
complex hybrids with height variations up to 300 mils.
Extremely accurate loop and force control.
Wire Range: 0.7 to 3.0 mil.
120V, 60 Hz.
Inventory#:
53670
Multiple photos.. 
AUTOMATED PRODUCTION SYSTEMS
MPP-21
Manual Pick and Place.
Uses pick up needle to manipulate die manually.
Can be configured to dispense, no dispense parts currently on system. 120V, 60 Hz.
Inventory#:
55334
Bid-Service
LLC, 225 Willow Brook Road, POB 6729 Freehold, NJ 07728 PHONE:
732-863-9500